Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Features
Low dielectric loss (RO3003™ laminates)
• Laminates can be used in applications up to 77 GHz.
Excellent mechanical properties versus temperature
• Reliable stripline and multi-layer board constructions.
Uniform mechanical properties for a range of dielectric constants
• Ideal for multi-layer board designs with a range of dielectric constants
• Suitable for use with epoxy glass multilayer board hybrid designs
Stable dielectric constant versus temperature and frequency (RO3003 laminates)
• Ideal for band pass filters, microstrip patch antennas, and voltage controlled oscillators.
Low in-plane expansion coefficient (match to copper)
• Allows for more reliable surface mounted assemblies
• Ideal for applications sensitive to temperature change
• Excellent dimensional stability Volume manufacturing process
• Economical laminate pricing
Applications & Uses
- Applications
- Recommended Applications
- Automotive radar applications
- Global positioning satellite antennas
- Cellular telecommunications systems - power amplifiers and antennas
- Patch antenna for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Dielectric Constant, εr, Process | 3.50 ± 0.05 | — | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Surface Resistivity | 1 x 10^7 | MΩ | IPC 2.5.17.1 |
| Dielectric Constant, εr, Design | 3.6 | — | Differential Phase Length Method |
| Volume Resistivity | 1 x 10^7 | MΩ-cm | IPC 2.5.17.1 |
| Dissipation Factor, tan d | 0.0015 | — | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of εr | -45 | ppm/°C | IPC-TM-650 2.5.5.5 |
| Dimensional Stability - X axis | -0.11 | mm/m | IPC TM-650 2.2.4 |
| Dimensional Stability - Y axis | 0.11 | mm/m | IPC TM-650 2.2.4 |
| Tensile Modulus - X axis | 1025 | MPa | ASTM D638 |
| Tensile Modulus - Y axis | 1006 | MPa | ASTM D638 |
| Moisture Absorption | 0.04 | % | IPC-TM-650 2.6.2.1 |
| Thermal Conductivity | 0.5 | W/m/°K | ASTM C518 |
| Coefficient of Thermal Expansion - X Axis | 17 | ppm/°C | ASTM D3386-94 |
| Coefficient of Thermal Expansion - Y Axis | 17 | ppm/°C | ASTM D3386-94 |
| Coefficient of Thermal Expansion Z Axis | 24 | ppm/°C | ASTM D3386-94 |
| Decomposition Temperature (Td) | 500 | °C TGA | ASTM D3850 |
| Density | 2.1 | g/cm3 | ASTM D792 |
| Copper Peel Strength | 10.2 | lb/in | IPC-TM-2.4.8 |