Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Features
RO4000® Series Thermoset Platform
- Reduced Overall Cost of PCB Manufacturing versus PTFE Laminate Options
Optimized filler, Resin & Glass Composite System
- Dielectric Constant at 77 GHz of 3.2
Reverse Treated Smooth LoPro® Copper Foil
- Excellent Insertion Loss
Optimized Filler & Flat Glass
- Good Laser Drilling Performance
- Consistent Within Sheet Dielectric Constant
Applications & Uses
- Applications
- Recommended Applications
76-81 GHz Automotive Radar Sensors
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Dielectric Constant, εr, Design | 3.24 | — | microstrip differential phase length |
| Transmission Line Loss | 2.2 | dB/in | microstrip differential phase length |
| Dissipation Factor, tan d | 0.0033 | — | split-post dielctric resonator |
| Thermal Coefficient of er (z direction) | -30 | ppm/°C | IPC-TM-650 2.5.5.5 |
| Dielectric Strength | 78.7 | kV/mm | IPC-TM-650, 2.5.6.2 |
| Water Absorption | 0.15 | % | ASTM D570 |
| Peel Strength after Thermal Stress | 0.67 | N/mm | IPC-TM-650 2.4.8 |
| Dimensional Stability (MD) | -1.8 | mm/m | IPC-TM-650 2.4.39A |
| Dimensional Stability (CMD) | -1.8 | mm/m | IPC-TM-650 2.4.39A |
| Decomposition Temperature (Td) | 408 | °C | ASTM D3850 |
| Time to Delamination (T288) | min. 30 | min | IPC-TM-650, 2.4.24.1 |
| Thermal Conductivity (calculated) | 0.45 | W/m/°K | Through-plane calculation with series mixing rule |
| Coefficient of Thermal Expansion - X Axis | 23 | ppm/°C | IPC-TM-650 2.4.41 |
| Coefficient of Thermal Expansion - Y Axis | 23 | ppm/°C | IPC-TM-650 2.4.41 |
| Coefficient of Thermal Expansion Z Axis | 110 | ppm/°C | IPC-TM-650 2.4.41 |