RTduroid® 5870 Laminates

Identification & Functionality

Chemical Family

Fluoropolymers

Reinforcement Material

Glass Fibers

Composite Materials Functions

Laminate

Technologies

Composite Materials

Product Families

Composite Materials — Prepregs & Molding Compounds

Laminates

Features & Benefits

Materials Features

Chemical Resistant,

Dimensional Stability,

Good Electrical Properties,

Good Mechanical Properties

Product Highlights

RT/duroid® 5870 and 5880 glass microfi ber reinforced PTFE composites are designed for exacting stripline and mi crostrip circuit applications. The randomly oriented microfi bers result in exceptional dielectric constant uniformity. The dielectric constant of RT/duroid 5870 and 5880 laminates is uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness of RT/duroid 5870 and 5880 laminates to Ku-band and above. RT/duroid 5870 and 5880 laminates are easily cut, sheared and machined to shape. They are resistant to all solvents and reagents, hot or cold, normally used in etching printed circuits or in plating edges and holes. Normally supplied as a laminate with electrodeposited copper of ½ to 2 ounces/ ft.2 (8 to 70m) or reverse treated EDC on both sides, RT/duroid 5870 and 5880 composites can also be clad with rolled copper foil for more critical electrical applications. Cladding with aluminum, copper or brass plate may also be specifi ed. When ordering RT/duroid 5870 and 5880 laminates, it is important to specify dielectric thickness, tolerance, rolled, electrodeposited or reverse treated copper foil, and weight of copper foil required.

Features

• Lowest electrical loss for reinforced
• PTFE material
• Low moisture absorption
• Isotropic
• Uniform electrical properties over frequency
• Excellent chemical resistance

Applications & Uses

Markets

Automotive & Transportation,

Electrical & Electronics

Applications

Electrical & Electronics — Parts & Components

Printed Circuit Boards (PCBs)

Automotive & Transportation — Transportation

Aerospace & Aviation

Recommended Applications

• Commercial Airline Broadband
• Antennas Microstrip and Stripline Circuits
• Millimeter Wave Applications
• Military Radar Systems
• Missile Guidance Systems
• Point to Point Digital Radio Antennas

Properties

Typical Properties

	Value	Units	Test Method / Conditions
Dielectric Constant, εr, Process at 1 MHz	2.33	—	IPC-TM-650 2.5.5.5
Surface Resistivity	2 x 10^7	MΩ	ASTM D257
Dielectric Constant, εr, Process at 10 MHz	2.33 ± 0.02	—	IPC-TM-650 2.5.5.5
Volume Resistivity	2 x 10^7	MΩ-cm	ASTM D257
Dielectric Constant, εr, Design	2.33	—	Differential Phase Length Method
Dissipation Factor tan d, at 1 MHz	0.0005	—	IPC-TM-650, 2.5.5.3
Dissipation Factor tan d, at 10 GHz	0.0012	—	IPC-TM-650 2.5.5.5
Thermal Coefficient of εr	-115	ppm/°C	IPC-TM-650 2.5.5.5
Specific Heat	0.96	J/g/°K	—
Tensile Modulus at 23 °C - X axis	189	kpsi	ASTM D638
Tensile Modulus at 23 °C - Y axis	185	kpsi	ASTM D638
Tensile Modulus at 100 °C - X axis	71	kpsi	ASTM D638
Tensile Modulus at 100 °C - Y axis	63	kpsi	ASTM D638
Tensile Ultimate Stress at 23 °C - X axis	7.3	kpsi	ASTM D638
Tensile Ultimate Stress at 23 °C - Y axis	6.1	kpsi	ASTM D638
Tensile Ultimate Stress at 100 °C - X axis	4.8	kpsi	ASTM D638
Tensile Ultimate Stress at 100 °C - Y axis	4.8	kpsi	ASTM D638
Tensile Ultimate Strain at 23 °C - X axis	9.8	%	ASTM D638
Tensile Ultimate Strain at 23 °C - Y axis	9.8	%	ASTM D638
Tensile Ultimate Strain at 100 °C - X axis	8.7	%	ASTM D638
Tensile Ultimate Strain at 100 °C - Y axis	8.6	%	ASTM D638
Compressive Modulus at 23 °C - X axis	176	kpsi	ASTM D695
Compressive Modulus at 23 °C - Y axis	198	kpsi	ASTM D695
Compressive Modulus at 23 °C - Z axis	120	kpsi	ASTM D695
Compressive Modulus at 100 °C - X axis	99	kpsi	ASTM D695
Compressive Modulus at 100 °C - Y axis	125	kpsi	ASTM D695
Compressive Modulus at 100 °C - Z axis	76	kpsi	ASTM D695
Compressive Ultimate Stress at 23 °C - X axis	4.4	kpsi	ASTM D695
Compressive Ultimate Stress at 23 °C - Y axis	5.3	kpsi	ASTM D695
Compressive Ultimate Stress at 23 °C - Z axis	7.8	kpsi	ASTM D695
Compressive Ultimate Stress at 100 °C - X axis	3.4	kpsi	ASTM D695
Compressive Ultimate Stress at 100 °C - Y axis	3.7	kpsi	ASTM D695
Compressive Ultimate Stress at 100 °C - Z axis	5.3	kpsi	ASTM D695
Compressive Ultimate Strain at 23 °C - X axis	4	%	ASTM D695
Compressive Ultimate Strain at 23 °C - Y axis	3.3	%	ASTM D695
Compressive Ultimate Strain at 23 °C - Z axis	8.7	%	ASTM D695
Compressive Ultimate Strain at 100 °C - X axis	4.3	%	ASTM D695
Compressive Ultimate Strain at 100 °C - Y axis	3.3	%	ASTM D695
Compressive Ultimate Strain at 100 °C - Z axis	8.5	%	ASTM D695
Moisture Absorption	0.02	%	ASTM D570
Thermal Conductivity	0.22	W/m/°K	ASTM C518
Coefficient of Thermal Expansion - X Axis	22	ppm/°C	IPC-TM-650 2.1.41
Coefficient of Thermal Expansion - Y Axis	28	ppm/°C	IPC-TM-650 2.1.41
Coefficient of Thermal Expansion Z Axis	173	ppm/°C	IPC-TM-650 2.1.41
Decomposition Temperature (Td)	500	°C TGA	ASTM D3850
Density	2.2	g/cm3	ASTM D792
Copper Peel	4.8	N/mm	IPC-TM-650 2.4.8