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Identification & Functionality
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Features & Benefits
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RT/duroid® 5870 and 5880 glass microfi ber reinforced PTFE composites are designed for exacting stripline and mi crostrip circuit applications. The randomly oriented microfi bers result in exceptional dielectric constant uniformity. The dielectric constant of RT/duroid 5870 and 5880 laminates is uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness of RT/duroid 5870 and 5880 laminates to Ku-band and above. RT/duroid 5870 and 5880 laminates are easily cut, sheared and machined to shape. They are resistant to all solvents and reagents, hot or cold, normally used in etching printed circuits or in plating edges and holes. Normally supplied as a laminate with electrodeposited copper of ½ to 2 ounces/ ft.2 (8 to 70m) or reverse treated EDC on both sides, RT/duroid 5870 and 5880 composites can also be clad with rolled copper foil for more critical electrical applications. Cladding with aluminum, copper or brass plate may also be specifi ed. When ordering RT/duroid 5870 and 5880 laminates, it is important to specify dielectric thickness, tolerance, rolled, electrodeposited or reverse treated copper foil, and weight of copper foil required.
Applications & Uses
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Dielectric Constant, εr, Process at 1 MHz | 2.2 | — | IPC-TM-650 2.5.5.5 |
| Surface Resistivity | 3 x 10^7 | MΩ | ASTM D257 |
| Dielectric Constant, εr, Process at 10 MHz | 2.20 ± 0.02 | — | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 2 x 10^7 | MΩ-cm | ASTM D257 |
| Dielectric Constant, εr, Design | 2.2 | — | Differential Phase Length Method |
| Dissipation Factor tan d, at 1 MHz | 0.0004 | — | IPC-TM-650, 2.5.5.3 |
| Dissipation Factor tan d, at 10 GHz | 0.0009 | — | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of εr | -125 | ppm/°C | IPC-TM-650 2.5.5.5 |
| Specific Heat | 0.96 | J/g/°K | — |
| Tensile Modulus at 23 °C - X axis | 156 | kpsi | ASTM D638 |
| Tensile Modulus at 23 °C - Y axis | 125 | kpsi | ASTM D638 |
| Tensile Modulus at 100 °C - X axis | 65 | kpsi | ASTM D638 |
| Tensile Modulus at 100 °C - Y axis | 55 | kpsi | ASTM D638 |
| Tensile Ultimate Stress at 23 °C - X axis | 4.2 | kpsi | ASTM D638 |
| Tensile Ultimate Stress at 23 °C - Y axis | 3.9 | kpsi | ASTM D638 |
| Tensile Ultimate Stress at 100 °C - X axis | 2.9 | kpsi | ASTM D638 |
| Tensile Ultimate Stress at 100 °C - Y axis | 2.6 | kpsi | ASTM D638 |
| Tensile Ultimate Strain at 23 °C - X axis | 6 | % | ASTM D638 |
| Tensile Ultimate Strain at 23 °C - Y axis | 4.9 | % | ASTM D638 |
| Tensile Ultimate Strain at 100 °C - X axis | 7.2 | % | ASTM D638 |
| Tensile Ultimate Strain at 100 °C - Y axis | 5.8 | % | ASTM D638 |
| Compressive Modulus at 23 °C - X axis | 103 | kpsi | ASTM D695 |
| Compressive Modulus at 23 °C - Y axis | 103 | kpsi | ASTM D695 |
| Compressive Modulus at 23 °C - Z axis | 136 | kpsi | ASTM D695 |
| Compressive Modulus at 100 °C - X axis | 73 | kpsi | ASTM D695 |
| Compressive Modulus at 100 °C - Y axis | 73 | kpsi | ASTM D695 |
| Compressive Modulus at 100 °C - Z axis | 97 | kpsi | ASTM D695 |
| Compressive Ultimate Stress at 23 °C - X axis | 3.9 | kpsi | ASTM D695 |
| Compressive Ultimate Stress at 23 °C - Y axis | 5.3 | kpsi | ASTM D695 |
| Compressive Ultimate Stress at 23 °C - Z axis | 7.5 | kpsi | ASTM D695 |
| Compressive Ultimate Stress at 100 °C - X axis | 3.2 | kpsi | ASTM D695 |
| Compressive Ultimate Stress at 100 °C - Y axis | 3.1 | kpsi | ASTM D695 |
| Compressive Ultimate Stress at 100 °C - Z axis | 6.3 | kpsi | ASTM D695 |
| Compressive Ultimate Strain at 23 °C - X axis | 8.5 | % | ASTM D695 |
| Compressive Ultimate Strain at 23 °C - Y axis | 7.7 | % | ASTM D695 |
| Compressive Ultimate Strain at 23 °C - Z axis | 12.5 | % | ASTM D695 |
| Compressive Ultimate Strain at 100 °C - X axis | 8.4 | % | ASTM D695 |
| Compressive Ultimate Strain at 100 °C - Y axis | 7.8 | % | ASTM D695 |
| Compressive Ultimate Strain at 100 °C - Z axis | 17.6 | % | ASTM D695 |
| Moisture Absorption | 0.02 | % | ASTM D570 |
| Thermal Conductivity | 0.2 | W/m/°K | ASTM C518 |
| Coefficient of Thermal Expansion - X Axis | 31 | ppm/°C | IPC-TM-650 2.1.41 |
| Coefficient of Thermal Expansion - Y Axis | 48 | ppm/°C | IPC-TM-650 2.1.41 |
| Coefficient of Thermal Expansion Z Axis | 237 | ppm/°C | IPC-TM-650 2.1.41 |
| Decomposition Temperature (Td) | 500 | °C TGA | ASTM D3850 |
| Density | 2.2 | g/cm3 | ASTM D792 |
| Copper Peel | 5.5 | N/mm | IPC-TM-650 2.4.8 |