Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Reinforcement Material
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Product Highlights
RT/duroid® 6006/6010LM microwave laminates are ceramic PTFE composites designed for electronic and microwave circuit applications requiring a high dielectric constant.
RT/duroid 6006 laminate is available with a dielectric constant value of 6.15 and RT/duroid 6010LM laminate has a dielectric constant of 10.2.
RT/duroid 6006/6010LM microwave laminates feature ease of fabrication and stability in use. They have tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.
RT/duroid 6006/6010LM laminates are supplied clad both sides with 1/2 oz. to 2 oz./ft2 (18 to 70 mm) standard and reverse treated electrodeposited copper foil. Thick aluminum, brass, or copper plate on one side may be specified. Standard tolerance dielectric thicknesses of 0.010”, 0.025”, 0.050”, 0.075”, and 0.100” (0.254, 0.635, 1.270, 1.905, 2.54 mm) are available.
When ordering RT/duroid 6006 and RT/duroid 6010LM laminates, it is important to specify dielectric thickness and weight of copper foil required.- Features
- High dielectric constant for circuit size reduction
- Low loss.
- Ideal for operating at X-ban or below
- Low Z-axis expansion for RT/duroid 6010LM. Provides reliable plated through holes in multilayer boards
- Low moisture absorption for RT/duroid 6010LM. Reduces effects of moisture on electrical loss
- Tight εr and thickness control for repeatable circuit performance
Applications & Uses
- Applications
- Recommended Applications
- Patch Antennas
- Satellite Communications Systems
- Power Amplifiers
- Aircraft Collision Avoidance Systems
- Ground Radar Warning Systems
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Dielectric Constant, εr, Process at 10 MHz | 10.2 ± 0.25 | — | IPC-TM-650 2.5.5.5 |
| Surface Resistivity | 5 x 10^5 | MΩ | IPC-TM-650, 2.5.17.1 |
| Dielectric Constant, εr, Design at 10 MHz | 10.7 | — | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 5 x 10^6 | MΩ-cm | IPC-TM-650, 2.5.17.1 |
| Dissipation Factor tan d, at 10 GHz | 0.0023 | — | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of εr | -425 | ppm/°C | IPC-TM-650 2.5.5.5 |
| Tensile Modulus at 23 °C - X axis | 135 | kpsi | ASTM D638 |
| Tensile Modulus at 23 °C - Y axis | 81 | kpsi | ASTM D638 |
| Tensile Ultimate Stress - X axis | 2.4 | kpsi | ASTM D638 |
| Tensile Ultimate Stress - Y axis | 1.9 | kpsi | ASTM D638 |
| Tensile Ultimate Strain - X axis | 9 - 15 | % | ASTM D638 |
| Tensile Ultimate Strain - Y axis | 7 - 14 | % | ASTM D638 |
| Compressive Modulus | 311 | kpsi | ASTM D695 |
| Compressive Ultimate Stress | 6.9 | kpsi | ASTM D695 |
| Compressive Ultimate Strain | 25 | % | ASTM D695 |
| Flexural Modulus - X axis | 633 | kpsi | ASTM D790 |
| Flexural Modulus - Y axis | 544 | kpsi | ASTM D790 |
| Flexural Ultimate Stress - X axis | 5.2 | kpsi | ASTM D790 |
| Flexural Ultimate Stress - Y aixs | 4.4 | kpsi | ASTM D790 |
| Deformation under load at 50 °C | 0.26 | % | ASTM D261 |
| Deformation under load at 150 °C | 1.37 | % | ASTM D261 |
| Moisture Absorption | 0.01 | % | IPC-TM-650, 2.6.2.1 |
| Density | 3.1 | g/cm3 | ASTM D792 |
| Thermal Conductivity | 0.86 | W/m/°K | ASTM C518 |
| Coefficient of Thermal Expansion - X Axis | 24 | ppm/°C | IPC-TM-650 2.4.41 |
| Coefficient of Thermal Expansion - Y Axis | 24 | ppm/°C | IPC-TM-650 2.4.41 |
| Coefficient of Thermal Expansion Z Axis | 47 | ppm/°C | IPC-TM-650 2.4.41 |
| Decomposition Temperature (Td) | 500 | °C TGA | ASTM D3850 |
| Specific Heat | 0.239 | J/g/°K | — |
| Copper Peel | 2.1 | N/mm | IPC-TM-650 2.4.8 |