Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Reinforcement Material
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Product Highlights
TC350 is a woven fiberglass reinforced, ceramic filled, PTFEbased composite for use as a printed circuit board substrate. TC350 is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies. The increased thermal conductivity of TC350 provides higher power handling, reduces hot-spots and improves device reliability. This higher heat transfer within the substrate complements designs using coins, heat sinks or thermal vias to provide designers additional design margin in managing heat. In designs with limited thermal management options, TC350 significantly improves heat transfer where the primary thermal path is through the laminate. This results in reduced junction temperatures and extends the life of active components, which is critical for improving power amplifier reliability, extending MTBF and reducing warranty costs. In addition, lower operating temperatures and chip-matching thermal expansion characteristics provide better reliability for component attachment prone to solder fatigue, solder softening and joint failure. TC350 has excellent Dielectric Constant Stability across a wide temperature range. This helps Power Amplifier and Antenna designers maximize gain and minimize dead bandwidth lost to dielectric constant drift as operating temperature changes. Dielectric constant stability is also critical to phase and impedance sensitive devices such as network transformers utilized for impedance matching networks utilized in power amplifier circuitry or in Wilkinson Power Dividers. TC350 has low Z-Direction CTE which matches copper. This feature provides unsurpassed plated through hole reliability. TC350 is a “soft substrate” and relatively insensitive to stress from vibration and impact from today’s drop testing requirements. TC350 enjoys a strong bond to copper, utilizing microwave grade, low profile copper. Unlike ceramic hydrocarbons that need to utilize “toothy copper” to achieve acceptable bond, TC350 utilizes relatively smooth copper. This results in even lower insertion loss due to skin effect losses of copper that are more obvious at higher RF and microwave frequencies.
- Features
- “Best in Class” Thermal Conductivity (1.0 W/mK) and Dielectric Constant Stability across Wide Temperatures (-9 ppm/ºC)
- Very Low Loss Tangent provides Higher Amplifier or Antenna Efficiency
- Priced Affordably for Commercial Applications
- Easier to drill than traditional commercial based laminates utilizing thick and dense style woven glass
- High Peel Strength for Reliable Copper Adhesion in thermally stressed applications
- Benefits
- Heat Dissipation and Management
- Improved Processing and Reliability
- Large Panel Sizes for Multiple Circuit
- Layout for lowered Processing Costs
Applications & Uses
- Applications
- Recommended Applications
- Power Amplifiers, Filters and Couplers
- Tower Mounted Amplifiers (TMA) and
- Tower Mounted Boosters (TMB)
- Thermally Cycled Antennas sensitive to dielectric drift
- Microwave Combiner and Power Dividers
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Dielectric Constant at 1 MHz | 3.5 | — | IPC TM-650 2.5.5.3 |
| Surface Resistivity (C96/35/90) | 3.2 x 10^7 | MΩ | IPC TM-650 2.5.17.1 |
| Dielectric Constant at 1.8 GHz | 3.5 | — | RESONANT CAVITY |
| Surface Resistivity (E24/125) | 4.3 x 10^8 | MΩ | IPC TM-650 2.5.17.1 |
| Dielectric Constant at 10 GHz | 3.5 | — | IPC TM-650 2.5.5.5 |
| Volume Resistivity (C96/35/90) | 7.4 x 10^6 | MΩ-cm | IPC TM-650 2.5.17.1 |
| Dissipation Factor at 1 MHz | 0.0015 | — | IPC TM-650 2.5.5.3 |
| Volume Resistivity (E24/125) | 1.4 x 10^8 | MΩ-cm | IPC TM-650 2.5.17.1 |
| Dissipation Factor at 1.8 GHz | 0.0018 | — | RESONANT CAVITY |
| Dissipation Factor tan d, at 10 GHz | 0.002 | — | IPC TM-650 2.5.5.5 |
| Temperature Coefficient of Dielectric - TC r at 10 GHz | -9 | ppm/°C | IPC TM-650 2.5.5.5 |
| Electrical Strength | 31 | kV/mm | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | 40 | kV | IPC TM-650 2.5.6 |
| Arc Resistance | min. 240 | seconds | IPC TM-650 2.5.1 |
| Td, Initial | 520 | °C | IPC TM-650 2.4.24.6 |
| Td, 5% | 567 | °C | IPC TM-650 2.4.24.6 |
| T260 | min. 60 | min | IPC TM-650 2.4.24.1 |
| Time to Delamination (T288) | min. 60 | min | IPC TM-650 2.4.24.1 |
| T300 | min. 60 | min | IPC TM-650 2.4.24.1 |
| Thermal Expansion, CTE (x,y) 50-150ºC | 7, 7 | ppm/°C | IPC TM-650 2.4.41 |
| Thermal Expansion, CTE (z) 50-150ºC | 23 | ppm/°C | IPC TM-650 2.4.24 |
| Expansion (50-260ºC), Zaxis | 1.2 | % | IPC TM-650 2.4.24 |
| Peel Strength to Copper after thermal stress | 1.2 | N/mm | IPC TM-650 2.4.8 |
| Peel Strength to Copper at elevated temperatures | 1.6 | N/mm | IPC TM-650 2.4.8.2 |
| Peel Strength to Copper after process solutions | 1.2 | N/mm | IPC TM-650 2.4.8 |
| Flexural Strength (M/C) | 14/10 | kpsi | IPC TM-650 2.4.4 |
| Tensile Strength (M/C) | 11/8 | kpsi | IPC TM-650 2.4.18.3 |
| Water Absorption | 0.05 | % | IPC TM-650 2.6.2.1 |
| Density | 2.3 | g/cm3 | ASTM D792 Method A |
| Thermal Conductivity | 0.72 | W/m/°K | ASTM D5470 |
| Specific Heat | 0.9 | J/g/°K | ASTM D5470 |
| Outgassing Total Mass Loss | 0.02 | % | NASA SP-R-0022A |
| Outgassing Collected Volatile Condensable Material | 0.01 | % | NASA SP-R-0022A |
| Outgassing Water Vapor Recovered | 0.01 | % | NASA SP-R-0022A |
Technical Details & Test Data
- Change vs. Frequency
Demonstrates the Stability of Dielectric Constant across Frequency.This information was correlated from data generated by using a free space and circular resonator cavity. This characteristic demonstrates the inherent robustness of Arlon Laminates across Frequency, thus simplifying the final design process when working across EM spectrum. The stability of the Dielectric Constant of TC350 over frequency ensures easy design transition and scalability of design.
- Dissipation Factor vs. Frequency
Demonstrates the Stability of Dissipation Factor across Frequency.This characteristic demonstrates the inherent robustness of Arlon Laminates across Frequency, providing a stable platform for high frequency applications where signal integrity is critical to the overall performance of the application.
Packaging & Availability
- Material Availability
TC350 laminate is supplied with 1/2, 1 or 2 ounce electrodeposited or reverse treat copper on both sides. Other copper weights may be available. TC350 is available bonded to heavy metal ground planes. Aluminum, brass or copper plates also provide an integral heat sink and mechanical support to the substrate. When requesting samples of TC350 product, please specify thickness, cladding, panel size, and any other special considerations. Panel sizes cut from a master sheet include: 12” x 18”, 18” X 24”, 16” X 18”. Contact Customer Service for other custom panel sizes.