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LEXAN™ Copolymer DMX1435

1 of 148 products in this brand
SABIC's Specialties Business LEXAN™ DMX1435 is a UV stabilized standard flow polycarbonate copolymer resin with improved scratch resistance, improved dielectric performance (lower Df). It is both transparency and colorable available solutions to the applications such as 5G related devices, anti-scratch covers, etc. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Polymer Name: Polycarbonate (PC)

Additives Included: UV Stabilizer

Processing Methods: Injection Molding

Flexural Modulus: 2450.0 - 2450.0 MPa

Technical Data Sheet

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Identification & Functionality

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Plastics & Elastomers Processing Methods

Properties

Flame Rating
Mechanical Properties
ValueUnitsTest Method / Conditions
Tensile Stress (Yield, Type I, 50 mm/min) ¹¹80MPaASTM D638
Tensile Stress (Break, Type I, 50 mm/min) ¹¹65MPaASTM D638
Tensile Strain (Yield, Type I, 50 mm/min) ¹¹7%ASTM D638
Tensile Strain (Break, Type I, 50 mm/min) ¹¹70%ASTM D638
Tensile Modulus (at 50 mm/min) ¹¹2900MPaASTM D638
Tensile Modulus (at 50 mm/min) ¹¹2563MPaASTM D638
Flexural Stress (Yield, 1.3 mm/min, 50 mm span) ¹¹120MPaASTM D790
Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹2600MPaASTM D790
Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹2469MPaASTM D790
Hardness (Rockwell L) ¹¹108ASTM D785
Hardness (Rockwell M) ¹¹93ASTM D785
Taber Abrasion (CS-17, 1 kg) ¹¹10mg/1000cyASTM D1044
Taber Abrasion (CS-17, 1 kg) ¹¹10mg/1000cySABIC method
Tensile Stress (Yield, 50 mm/min) ¹¹80MPaISO 527
Tensile Stress (Break, 50 mm/min) ¹¹60MPaISO 527
Tensile Strain (Yield, 50 mm/min) ¹¹7%ISO 527
Tensile Strain (Break, 50 mm/min) ¹¹40%ISO 527
Tensile Modulus (at 1 mm/min) ¹¹2450MPaISO 527
Flexural Stress (Yield, at 2 mm/min) ¹¹108MPaISO 178
Flexural Modulus (at 2 mm/min) ¹¹2450MPaISO 178
Ball Indentation Hardness (H358/30) ¹¹128MPaISO 2039-1
Pencil Hardness Test (at 1 kgf) ¹¹HASTM D3363
Erichson Scratch Depth (6N) ¹¹14micrometerSABIC method
Physical Properties
ValueUnitsTest Method / Conditions
Specific Gravity ¹¹1.2ASTM D792
Specific Volume ¹¹0.85cm³/gASTM D792
Density ¹¹1.17g/cm³ASTM D792
Density ¹¹1.17g/cm³ISO 1183
Water Absorption (at 23°C, 24hrs) ¹¹0.08%ASTM D570
Water Absorption (at 23°C, saturated) ¹¹0.28%ASTM D570
Water Absorption (at 23°C, saturated) ¹¹0.27%ISO 62-1
Moisture Absorption (at 50% RH, Equilibrium) ¹¹0.13%ASTM D570
Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹0.04%ASTM D570
Mold Shrinkage (flow, 3.2 mm) ⁸ ¹¹0.5 - 0.8%SABIC method
Mold Shrinkage (flow, 3.2 mm) ʰ ¹¹0.5 - 0.8%SABIC method
Melt Flow Rate (at 300°C, 1.2 kgf) ¹¹14.5g/10 minASTM D1238
Moisture Absorption (at 23°C, 50% RH) ¹¹0.13%ISO 62
Melt Volume Rate (at 300°C, 1.2 kg) ¹¹13cm³/10 minISO 1133
Thermal Properties
ValueUnitsTest Method / Conditions
Vicat Softening Temperature (Rate B/50) ¹¹138°CISO 306
Vicat Softening Temperature (Rate B/50) ¹¹139°CASTM D1525
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹133°CASTM D648
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹119°CASTM D648
Coefficient of Thermal Expansion (at -40°C to 95°C, flow) ¹¹0.000071/°CASTM E831
Coefficient of Thermal Expansion (at -40°C to 95°C, xflow) ¹¹0.000071/°CASTM E831
Specific Heat ¹¹1.4J/g-°CASTM C351
Thermal Conductivity ¹¹0.2W/m-°CISO 8302
Thermal Conductivity ¹¹0.2W/m-°CASTM C177
Coefficient of Thermal Expansion (at 23°C to 80°C, flow) ¹¹0.000071/°CISO 11359-2
Coefficient of Thermal Expansion (at 23°C to 80°C, xflow) ¹¹0.000071/°CISO 11359-2
Ball Pressure Test (at 123°C to 127°C) ¹¹PassIEC 60695-10-2
Ball Pressure Test (approximate maximum) ¹¹140°CIEC 60695-10-2
Vicat Softening Temperature (Rate B/120) ¹¹140°CISO 306
Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80*10*4, sp=64mm) ¹¹131°CISO 75/Bf
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹118°CISO 75/Af
Relative Temperature Index (Electrical) ᵖ ¹¹80°CUL 746B
Relative Temperature Index (Mechanical with impact) ᵖ ¹¹80°CUL 746B
Relative Temperature Index (Mechanical without impact) ᵖ ¹¹80°CUL 746B
Electrical Properties
ValueUnitsTest Method / Conditions
Comparative Tracking Index (UL, PLC) ¹¹2PLC CodeUL 746A
Dielectric Constant (at 1.1 GHz) ¹¹2.74SABIC method
Dielectric Constant (at 1.9 GHz) ¹¹2.7SABIC method
Dielectric Constant (at 5 GHz) ¹¹2.71SABIC method
Dielectric Constant (at 10 GHz) ¹¹2.71SABIC method
Dissipation Factor (at 1.1 GHz) ¹¹0.0024SABIC method
Dissipation Factor (at 1.9 GHz) ¹¹0.0022SABIC method
Dissipation Factor (at 5 GHz) ¹¹0.0022SABIC method
Dissipation Factor (at 10 GHz) ¹¹0.0024SABIC method
Optical Properties
ValueUnitsTest Method / Conditions
Light Transmission (at 2.54 mm) ¹¹88%ASTM D1003
Haze (at 2.54 mm) ¹¹max. 0.8%ASTM D1003
Refractive Index ¹¹1.584ASTM D542
Refractive Index ¹¹1.584ISO 489
Impact Properties
ValueUnitsTest Method / Conditions
Izod Impact (Unnotched, at 23°C) ¹¹No breakJ/mASTM D4812
Izod Impact (Notched, at 23°C) ¹¹30J/mASTM D256
Izod Impact (Notched, at -30°C) ¹¹30J/mASTM D256
Instrumented Dart Impact Total Energy (at 23°C) ¹¹30JASTM D3763
Izod Impact (Unnotched, 80*10*3, at 23°C) ¹¹No breakkJ/m²ISO 180/1U
Izod Impact (Unnotched, 80*10*3, at -30°C) ¹¹45kJ/m²ISO 180/1U
Izod Impact (Notched, 80*10*3, at 23°C) ¹¹5kJ/m²ISO 180/1A
Izod Impact (Notched, 80*10*3, at -30°C) ¹¹4kJ/m²ISO 180/1A
Charpy Impact (at 23°C, V-notch Edgew 80*10*3 sp=62mm) ¹¹3kJ/m²ISO 179/1eA
Charpy Impact (at -30°C, V-notch Edgew 80*10*3 sp=62mm) ¹¹3kJ/m²ISO 179/1eA
Charpy Impact (at 23°C, Unnotch Edgew 80*10*3 sp=62mm) ¹¹No breakkJ/m²ISO 179/1eU
Charpy Impact (at -30°C, Unnotch Edgew 80*10*3 sp=62mm) ¹¹47kJ/m²ISO 179/1eU
Injection Molding
ValueUnitsTest Method / Conditions
Drying Temperature ᶜ120°C
Drying Time ᶜ3 - 4Hrs
Maximum Moisture Content ᶜ0.02%
Melt Temperature ᶜ295 - 315°C
Nozzle Temperature ᶜ290 - 310°C
Front - Zone 3 Temperature ᶜ295 - 315°C
Middle - Zone 2 Temperature ᶜ280 - 305°C
Rear - Zone 1 Temperature ᶜ260 - 280°C
Hopper Temperature ᶜ60 - 80°C
Mold Temperature ᶜ70 - 95°C
Flame Characteristics
ValueUnitsTest Method / Conditions
UL Recognized (94HB Flame Class Rating) ᵖmin. 0.6mmUL 94
Glow Wire Ignitability Temperature (at 3.0 mm) ᵖ825°CIEC 60695-2-13
Glow Wire Ignitability Temperature (at 2.0 mm) ᵖ825°CIEC 60695-2-13
Glow Wire Ignitability Temperature (at 1.0 mm) ᵖ850°CIEC 60695-2-13
Glow Wire Flammability Index (at 3 mm) ᵖ960°CIEC 60695-2-12
Glow Wire Flammability Index (at 2 mm) ᵖ960°CIEC 60695-2-12
Glow Wire Flammability Index (at 1 mm) ᵖ900°CIEC 60695-2-12
Note
  • ⁸ Measurements made from laboratory test coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article. The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
  • ᶜ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding. Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.
  • ʰ Measurements made from laboratory test coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.
  • ᵖ UL ratings shown on the technical datasheet might not cover the full range of thicknesses and colors. For details, please see the UL Yellow Card.
  • ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
 

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