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Identification & Functionality
- Chemical Family
- Chemical Name
- Base Chemicals Functions
- CASE Ingredients Functions
- Technologies
- Product Families
- Chemical Structure
Bisphenol-A Dianhydride, BisDA
Features & Benefits
- Labeling Claims
- Base Chemicals Features
- CASE Ingredients Features
- Materials Features
- Benefits of BISDA
BISDA (BPA based dianhydride) has excellent thermal properties that may be used as a co-monomer in Polyimide synthesis or as a curing agent in epoxy thermoset systems. BISDA is provided as a flake and is soluble in the typical organic solvents used in polyimide varnishes, coatings, adhesives, films and wire enamels. Incorporating BISDA into polyimide formulations may provide enhanced performance in: heat resistance, flexibility/softness, dimensional stability and metal adhesion properties. In epoxy systems, BISDA as a curing agent may offer improved thermal performance, increased pot life, easier handling, improved chemical resistance, better toughness, lower dielectric properties, lower shrinkage and lower moisture absorption.
Applications & Uses
- Markets
- Applications
- Applicable Processes
- Compatible Substrates & Surfaces
- Base Chemicals End Uses
- Plastics & Elastomers End Uses
- Processing Guidelines
- Add BISDA into MTHPA
Scale 120 - 130 gms
- BISDA content: 6 - 20 wt%
- Mixing temperature: 22°C
- Time: 3 minutes
Observations: Turbid solutions.
2. Heat mixture at 120°C
BISDA content Vs heating time
- 6.7 wt% >>> 15 min
- 13.1 wt% >>> 20 min
- 19.2 wt% >>> 30 min
Observation: Clear Solutions
3. Cool down 80°C and add D.E.R 332
Scale: 275-285 gms
- Anhydride to epoxy ratio: 0.8
- Mixing temperature: 80°C
- Time: 3 min
Observations: Clear Solution
4. Add catalyst 2E-4MI at 80°C
Scale: 275-285 gms
- 2E-4MI content: wt%
- Mixing temperature: 80°C
- Time: 2 min
Observation: Clear Solutions
5. Pour into a pre heated mold
Scale: 275-285 gms
- Mold Temperature: 130°C
- Pouring Time: 2 - 3 min
6. Thermal Curing
Curing Profile
- 80°C >> 30 min
- 120°C >> 30 min
- 150°C >> 30 min
- 180°C >> 60 min
Properties
- Physical Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Mw | 520.49 | — | SABIC method |
| Solubility (In Methyl Ethyl Ketone, at 75°C) | 10 | Wt. % | SABIC method |
| Value | Units | Test Method / Conditions | |
| Melting point | 185 - 190 | °C | — |
| Boiling Point | min. 314 | °C | — |
Technical Details & Test Data
- Achieving High Heat Epoxy Formulations Using BISDA
BISDA loading (wt%) in overall formulation
Unit 0% 6.70% 13.10% 19.20% Thermal Performance Tg by DMA °C 145 164 173 182 Viscosity of BISDA MTHPA blends
Dynamic Viscosity @ 25°C cP 400 1100 3000 8000 Dynamic Viscosity @ 90°C cP 38 42 48 80 Formulations: Epoxy: D.E.R.(TM) 332* phr 100 100 100 100 MTHPA** phr 78.1 70.3 62.5 54.7 BISDA** phr 0 12.2 24.5 36.7 2E 4 MI*** phr 1.8 1.8 1.9 1.9 * Anhydride to Epoxy (A/E) ratio: 0.8
** Anhydride BISDA 1000 /(Anhydride MTHPA + Anhydride BISDA 1000 )): 0, 0.1, 0.2 and 0.3
*** Catalyst content: 1 wt % of total formulation
Packaging & Availability
- Country Availability
- Regional Availability