Products

ECP 110 Anti Static High Impact Conductive Polypropylene is a conductive Polypropylene based on Conductive Carbon Black and Polypropylene co-polymer suitable for injection molding and profile extrusion. It is designed to comply with the electrical conductivity requirements laid out in Defense Standard 59 - 98 (1979) and BS IEC 61340-5-1-2007 for the protection of electronic components from electrostatic damage.

ECP 41899 is a proprietary injection molding compound utilizing special polymer alloys to give a permanently anti static dissipative material. The material is specially designed for applications requiring static control and good optical qualities eg, transparency.

Permanently anti-static dissipative colourable PP. Suitable for injection molding and extrusion. Compliant with ATEX requirements and BS IEC 61340-5-1:2007. It is an injection molding compound utilizing a special non-migratory additive system to give a permanently anti-static dissipative material. The material is specially designed for applications requiring static control such as electronic safe handling areas and hazardous environments.

ECP 9906 is Conductive Glass Fiber Filled Polyphenylene Sulfide Carbon Nanotube Compound Injection Molding proprietary TBA ECP injection molding compound utilizing multi wall carbon nanotube technology to give a permanently conductive material. Special compounding techniques at low filler loadings ensure the retention of physical properties and excellent cleanliness. ECP 9906 is a very high performance thermoplastic with a very high modulus and strength plus a very high continuous service temperature (240°C, short term exposure up to 270°C). It is inherently flame retardant (UL 94 V0), has very good chemical and oxidation resistance, very low water absorption and very low creep, even at elevated temperatures.

ECP 16E is a stainless steel fiber masterbatch within a Nylon 6/12 binder, 25% by weight. It can be used with Nylon 6, 6/6, 6/10, 6/12, PBT, PET.

ECP 9905 is Conductive Glass Fiber Filled Polyphenylene Sulfide Carbon Nanotube Compound Injection Molding proprietary TBA ECP injection molding compound utilizing multi wall carbon nanotube technology to give a permanently conductive material. Special compounding techniques at low filler loadings ensure the retention of physical properties and excellent cleanliness. ECP 9905 is a very high performance thermoplastic with a very high modulus and strength plus a very high continuous service temperature (240°C, short term exposure up to 270°C). It is inherently flame retardant (UL 94 V0), has very good chemical and oxidation resistance, very low water absorption and very low creep, even at elevated temperatures.

ECP 104/4264 Conductive Polypropylene Injection Molding Compound - Low Resistance is a proprietary TBA injection molding compound utilizing special carbon black and mineral filler to give a permanently highly conductive, anti static material. The compound is designed to comply with the electrical conductivity requirements for materials laid out in Defense Standard (59-98) and BS IEC 61340-5-1:2007.

ECP 104 Anti Static Conductive Polypropylene is a proprietary injection molding compound utilizing special Carbon Black and mineral filler to give a permanently conductive material. The compound is designed to comply with the electrical conductivity requirements for materials laid out in Defense Standard (59-98) and BS EN 61340-5-1: 2007

ECP 9603 Conductive PC/PBT Carbon Nanotube Injection Molding Compound. ECP 9603 is a proprietary injection molding compound utilizing multi-wall carbon nanotube technology to give a permanently anti-static, conductive material. Special compounding techniques at low filler loadings ensure the retention of physical properties and excellent cleanliness.

ECP 2747 is a proprietary TBA injection molding compound utilizing a special non-migratory additive system to give a permanently static dissipative material. The material is specially designed for applications requiring static control such as electronic safe handling areas and hazardous environments where anti static and ESD (electro static discharge) is required.

ECP 555 silver/copper aerosol combines the EMI Shielding properties with a convenient method of application for prototype and touch up work. It is designed to give low resistance in thin-film thickness displaying excellent adhesion to most plastics it is ideal for electronic equipment housing. It exhibits excellent long term shielding and grounding properties whilst providing an esthetically pleasing appearance.

ECP 505 EMI Shielding Silver Plated Copper Paint Is supplied ready for use, it is designed to give low resistance in thin film thickness, and exhibits excellent EMI shielding and grounding properties displaying excellent adhesion to most plastics and is ideal for electronic equipment housing. It exhibits excellent long term shielding and grounding properties while providing an esthetically pleasing appearance.

ECP 9303 is Conductive PC/ABS Carbon Nanotube Compound Injection Molding proprietary TBA PS injection molding compound utilizing multi wall carbon nanotube technology to give a permanently conductive material. Special compounding techniques at low filler loadings ensure the retention of physical properties and excellent cleanliness.

ECP 12E is a stainless steel fiber masterbatch within an emulsion-based ethylene acrylic acid zinc ionomer binder, 25% by weight. It can be used with Styrenic Thermoplastics, PS, SAN, ABS also PPO and PPE Alloys, Polypropylene/Polyolefines.

ECP 9602 is Conductive PC/PBT Carbon Nanotube Compound Injection Molding proprietary TBA PS injection molding compound utilizing multi wall carbon nanotube technology to give a permanently conductive material. Special compounding techniques at low filler loadings ensure the retention of physical properties and excellent cleanliness.

ECP 9703 is Conductive Polycarbonate Carbon Nanotube Compound Injection Molding proprietary TBA PS injection molding compound utilizing multi wall carbon nanotube technology to give a permanently conductive material. Special compounding techniques at low filler loadings ensure the retention of physical properties and excellent cleanliness.

ECP 2368 is a proprietary TBA injection molding compound utilizing a special non-migratory additive system to give a permanently static dissipative material. The material is specially designed for applications requiring static control such as electronic safe handling areas and hazardous environments. Used for anti static applications where ESD (electro static discharge) is to be avoided.

ECP 41158 is a proprietary injection molding compound utilizing special polymer alloys to give a permanently anti static dissipative material. The material is specially designed for applications requiring static control and good optical qualities eg, transparency. The material is ideal for use in hazardous environments where static dissipation properties are required.

ECP 9604 is Conductive PC/PBT Carbon Nanotube Hybrid Compound Injection Molding High Emi Shielding proprietary TBA PS injection molding compound utilizing multi wall carbon nanotube technology to give a permanently conductive material. Special compounding techniques at low filler loadings ensure the retention of physical properties and excellent cleanliness. Synergistic hybrids of low levels of steel fibers ensure very high EMI shielding performance, whilst retaining good physical performance.