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Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly. Its adhesives include electrically conductive adhesives, thermally conductive adhesives, anisotropically conductive adhesives, ultra-low stress adhesives, and optoelectronics adhesives. Its encapsulants include UV curable glob top encapsulants, dam-and-fill encapsulants, and underfill encapsulants. Its underfill encapsulants include flip chip encapsulants and reworkable CSP and BGA encapsulants. Through its worldwide network of sales agents and stocking facilities, it serves customers in North and South America, Europe, and Asia. Zymet counts amongst its customers world-class multinational companies that are leaders in their industries. Customers include manufacturers of handheld and consumer electronics, computers, storage devices, automotive electronics, medical electronics, and military electronics.

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Zymet CSP-1412 is designed for BGA, CSP, and WL-CSP encapsulation. These packages are not typically encapsulated. However, it has been found that mobile phones and other handheld devices require encapsulation of these components to survive drop tests and repeated keypad actuations.

Zymet CSP-1412

Zymet UA-2605-B enhances the board level reliability of a large WLCSP. 

Zymet UA-2605-B

Zymet CN-1453 is a new reworkable BGA underfill encapsulant. It is a silica filled version.

Zymet CN-1453

Zymet CN-1751-4, is extraordinarily crack resistant, to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies. CN-1751-4 is a reworkable underfill that can withstand extraordinary deformation without cracking, yet has a modulus that is higher than that of traditional reworkable underfills.

Zymet CN-1751-4

Zymet CN-1736 is designed to enhance the drop test reliability of 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solder pastes and tacky fluxes.

Zymet CN-1736

Zymet CN-1735 is designed to enhance the board level thermal cycle performance of IC packages with pitches as fine as 0.3- mm pitch. CN-1735 will also enhance ruggedness, for drop and bend test performance.

Zymet CN-1735

Zymet CN-1703 is designed for CSP and BGA encapsulation. CSP’s and BGA’s are not normally encapsulated. However, it has been found that mobile phones and other handheld devices require encapsulation of these components to survive drop tests and repeated keypad actuations.

Zymet CN-1703

Zymet UVE-1017-2 cures in as little as 3 minutes, far less time than a conventional heat cured encapsulant. The fast cure increases line speed and productivity.

Zymet UVE-1017-2

Zymet TC-601.1 is electrically insulating and thermally conductive. It is a soft paste designed for syringe dispensing. TC-601.1, uniquely suited for bonding of stress sensitive devices such as microelectronic and micro-machined sensors. In the case of a microelectronic sensor, bending can generate unwanted piezoelectric signals. In the case of a micromachined device, bending can interfere with the motion of delicate mechanical devices.

Zymet TC-601.1

Zymet

Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly. Its adhesives include electrically conductive adhesives, thermally conductive 

Zymet - Adhesives - Encapsulants - Electronics - Assembly

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Zymet CN-1728 is designed to underfill Package-on-Package (POP) assemblies. Underfilled POP’s have greater difficulty in passing thermal cycle tests than underfilled BGA’s. Compared to earlier generation underfills, CN-1728 has a lower coefficient of thermal expansion and higher Tg, and better compatibility with flux residues, both of which contribute to its superior thermal cycle performance.

Zymet CN-1728 Technical Data Sheet

Zymet CN-1728 Technical Data Sheet - Zymet

Zymet CN-1728

Zymet CN-1728 is designed to underfill Package-on-Package (POP) assemblies. Underfilled POP’s have greater difficulty in passing thermal cycle tests than underfilled BGA’s. Compared to earlier generat

Zymet CN-1728 - Integrated Circuits - Knowde

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	Value	Units	Test Method / Conditions
Viscosity	900.0	cps	-

Zymet CN-1728

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