Products

Zymet UA-2605-B enhances the board level reliability of a large WLCSP.

Zymet CSP-1412 is designed for BGA, CSP, and WL-CSP encapsulation. These packages are not typically encapsulated. However, it has been found that mobile phones and other handheld devices require encapsulation of these components to survive drop tests and repeated keypad actuations.

Zymet TC-601.1 is electrically insulating and thermally conductive. It is a soft paste designed for syringe dispensing. TC-601.1, uniquely suited for bonding of stress sensitive devices such as microelectronic and micro-machined sensors. In the case of a microelectronic sensor, bending can generate unwanted piezoelectric signals. In the case of a micromachined device, bending can interfere with the motion of delicate mechanical devices.

Zymet CN-1728 is designed to underfill Package-on-Package (POP) assemblies. Underfilled POP’s have greater difficulty in passing thermal cycle tests than underfilled BGA’s. Compared to earlier generation underfills, CN-1728 has a lower coefficient of thermal expansion and higher Tg, and better compatibility with flux residues, both of which contribute to its superior thermal cycle performance.

Zymet CN-1453 is a new reworkable BGA underfill encapsulant. It is a silica filled version.

Zymet UVE-1017-2 cures in as little as 3 minutes, far less time than a conventional heat cured encapsulant. The fast cure increases line speed and productivity.

Zymet CN-1735 is designed to enhance the board level thermal cycle performance of IC packages with pitches as fine as 0.3- mm pitch. CN-1735 will also enhance ruggedness, for drop and bend test performance.

Zymet CN-1736 is designed to enhance the drop test reliability of 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solder pastes and tacky fluxes.

Zymet CN-1751-4, is extraordinarily crack resistant, to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies. CN-1751-4 is a reworkable underfill that can withstand extraordinary deformation without cracking, yet has a modulus that is higher than that of traditional reworkable underfills.

Zymet CN-1703 is designed for CSP and BGA encapsulation. CSP’s and BGA’s are not normally encapsulated. However, it has been found that mobile phones and other handheld devices require encapsulation of these components to survive drop tests and repeated keypad actuations.