- Applications:Printed Circuit Boards (PCBs), Appliances & Electronics, Semiconductor Manufacturing
- Product Families:Encapsulants, Adhesives & Sealants
Zymet CN-1728 is designed to underfill Package-on-Package (POP) assemblies. Underfilled POP’s have greater difficulty in passing thermal cycle tests than underfilled BGA’s. Compared to earlier generation underfills, CN-1728 has a lower coefficient of thermal expansion and higher Tg, and better compatibility with flux residues, both of which contribute to its superior thermal cycle performance.