Products in Electronics Adhesives: Binder & Resin

DEHESIVE® 902 AMA® is a solvent-free, addition-curing silicone fluid formulated for release applications on paper and filmic substrates. It is an integral component of a multicomponent release coating used in the production of paper and filmic release liners. These liners are widely utilized in the manufacturing of single- and double-sided industrial laminates.

DEHESIVE® 929 is a solvent-free, addition-curing silicone fluid designed for release applications. This product has good curing properties, very good flow properties and coverage, an extremely stable release, excellent bath life, and excellent long-term anchorage to a wide variety of substrates.

DEHESIVE® 944 is a solvent-based, addition-crosslinkable silicone recommended for use as a release coating. It offers excellent release stability, medium release at low peel speeds, excellent bath life, and excellent anchorage to a wide variety of substrates. It can be used for coating polyester films (PET), papers, and PE-laminated papers.

ALBIFLEX® 246 is an innovative Bisphenol-A-epoxy silicone block copolymer resin designed for crafting high-performance elastomers. This liquid resin, active with epoxy, seamlessly cures when paired with aliphatic and cycloaliphatic epoxy resin curing agents. ALBIFLEX® 246 offers versatility, supporting various casting and molding methods for your manufacturing needs.

ALBIFLEX® 297 is a bisphenol-A-epoxy-silicone block copolymer resin that excels in crafting high-performance elastomers. This versatile liquid, responsive to epoxy, seamlessly cures when combined with aliphatic and cycloaliphatic epoxy resin curing agents. ALBIFLEX® 297 accommodates various conventional casting and molding techniques for your manufacturing needs.

Evonik Polymer OR 501 is a specialized silicone polymer designed for non-staining, condensation-curing silicone formulations. This polymer is particularly recommended for low-modulus sealants and adhesives, especially in cases where the use of silicone oils as plasticizers is not advisable, such as in natural stone applications. It is characterized as hydroxy-terminated polydimethyl siloxanes.

Evonik VQM 907 formulations consist of vinylfunctional QM resin and vinylfunctional silicone polymers. These formulas are used to produce materials that are transparent, free of fillers, and have great mechanical qualities. They can also improve the mechanical properties and flow behavior of systems that are filled.

Evonik Polymer VS 100 comprises vinyl-terminated polydimethyl siloxanes available in various viscosity levels and molecular weights, featuring an impressively low content of volatile constituents. These polymers serve as essential base components in silicone formulations that cure through a platinum-catalyzed addition reaction with silicone crosslinkers containing SiH groups. The minimal presence of volatile constituents, combined with the crosslinking mechanism, ensures low curing shrinkage and prevents the formation of volatile or corrosive substances during the curing process.

Evonik Polymer VS 10000 consists of vinyl-terminated polydimethylsiloxanes available in different viscosity levels and molecular weights, with an impressively low content of volatile constituents. These polymers serve as fundamental components in silicone formulations that cure through a platinum-catalyzed addition reaction with silicone crosslinkers containing SiH groups. The minimal presence of volatile constituents and the crosslinking mechanism ensure that curing shrinkage remains low, and no volatile or corrosive substances are generated during the curing process.

Evonik Polymer OH 2 is a polydimethyl siloxane with terminal silanol groups, serving as a fundamental component in the formulation of condensation-curing silicone elastomers. This product is offered in a range of viscosity levels, spanning from 100 to 400,000 mPas. In its physical form, it appears clear and colorless. Chemically, it is characterized as hydroxy-terminated polydimethyl siloxanes.

Evonik Polymer VS 1000 consists of vinyl-terminated polydimethylsiloxanes available in different viscosity levels and molecular weights, with an impressively low content of volatile constituents. These polymers serve as fundamental components in silicone formulations that cure through a platinum-catalyzed addition reaction with silicone crosslinkers containing SiH groups. The minimal presence of volatile constituents and the crosslinking mechanism ensure that curing shrinkage remains low, and no volatile or corrosive substances are generated during the curing process.

Evonik VQM 909 formulations consist of vinylfunctional QM resin and vinylfunctional silicone polymers. These formulas are used to produce materials that are transparent, free of fillers, and have great mechanical qualities. They can also improve the mechanical properties and flow behavior of systems that are filled.

Evonik Polymer VS 500 consists of vinyl-terminated polydimethylsiloxanes available in different viscosity levels and molecular weights, with an impressively low content of volatile constituents. These polymers serve as fundamental components in silicone formulations that cure through a platinum-catalyzed addition reaction with silicone crosslinkers containing SiH groups. The minimal presence of volatile constituents and the crosslinking mechanism ensure that curing shrinkage remains low, and no volatile or corrosive substances are generated during the curing process.

Evonik VQM 973 formulations consist of vinylfunctional QM resin and vinylfunctional silicone polymers. These formulas are used to produce materials that are transparent, free of fillers, and have great mechanical qualities. They can also improve the mechanical properties and flow behavior of systems that are filled.

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SHIKOH™ UV-3700B is UV curable urethane acrylate oligomer with high elongation and soft rubbery elasticity. It is relatively low viscosity despite its high molecular weight. EB and Thermal cure systems are also applicable. Features Soft elastic type, High elongation High molecular weight but relatively low viscosity Non-solvent (100% hardening ingredient) For UV adhesion with monomers Non-yellowing Applications Adhesive: UV/ EB/ Thermal-curable adhesive for electronics device, optical use and automotive use. 3D printer *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SHIKOH™ UV-3300B is UV curable urethane acrylate oligomer with excellent soft-elasticity, and very high elongation. It also shows good mechanical properties even at low temperature. EB and Thermal cure systems are also applicable. Features Soft-elastic, High elongation Suitable for adhesion bond and metalizing undercoat with monomers Good mechanical properties at low temperature Non-yellowing Applications Adhesive : UV/ EB/ Thermal-curable adhesive for electronics device, optical use, and automotive use. 3D printer *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SHIKOH™ UT-7792 is a bio-based urethane acrylate oligomer. (Development product) Its biomass degree is 71% while its mechanical properties are the same as a non-biomass grade UV-3300B, with higher elongation and very soft rubbery elasticity suitable for using UV-curable adhesives for electronics devices. Features Bio-based Soft-elastic, High elongation Suitable for adhesion bond and metalizing undercoat with monomers Non-yellowing Applications Adhesive : UV/ EB/ Thermal-curable adhesive for electronics device, optical use, and automotive use. 3D printer *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1256 is a solid epoxy resin produced from Bisphenol A epoxy resin. It is a polymer-type epoxy resin with epoxy functional group at the both ends. It can be used to add toughness, insulating and vapor barrier properties, and resistance to heat, water and chemicals in a variety of applications. FeaturesHigh molecular weightHigh softening pointsGood film formerHydrolysis resistanceFlexibilityStrong adhesionApplicationsPCM, CAN, and other coatingsPaintsFiber-reinforced materialsThermoplasticsPrinted electronicsPlastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SHIKOH™ UV-3520TH is an aliphatic urethane acrylate oligomer with soft elasticity, good toughness and high elongation. It shows unique mechanical properties with various reactive diluents. Features Soft-Elastic type, Good toughness, High elongation Diluted in Tetrahydrofurfuryl Acrylate (THFA) (oligomer/ THFA = 70/30 wt%) Non-solvent (100% hardening ingredient) Unique mechanical properties with various reactive diluents Applications UV/ EB/ Thermal-curable adhesive UV adhesive for electric device use 3D printer, and Inkjet *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

Esschem incorporates sustainable plant-based plasticizers into methyl methacrylate MMA bead polymers. These innovative additives are designed to enhance the flexibility and workability of methacrylate-based polymers. By incorporating bio-plasticizers into MMA bead copolymers, the resulting materials exhibit increased flexibility and reduced glass transition temperature, melting points, and tensile strengths.The inclusion of higher molecular weight components contributes to stronger and more heat-resistant materials.Furthermore, the particle size plays a crucial role in surface properties, where smaller particles enhance adhesion while larger particles contribute to robustness and rigidity.

Esschem MMA - BMA Bead Copolymers are a range of copolymers combining methyl methacrylate (MMA) with butyl methacrylate (BMA).These copolymers offer a versatile solution with varying properties based on the MMA and BMA content. Higher MMA content results in copolymers with elevated glass transition temperatures, melting points, and tensile strengths, making them suitable for applications that require strength and rigidity. Conversely, increased BMA content lowers these properties while enhancing processability and potential flexibility.By adjusting the molecular weight, Esschem can tailor the copolymer structure to achieve specific rigidity requirements. Additionally, controlling the particle size allows for improvements in mechanical strength, with smaller particles offering larger surface area to volume ratios.

Esschem MMA - Styrene Bead Copolymers are a versatile range of copolymers combining methyl methacrylate (MMA) and styrene. These bead copolymers offer a wide array of properties and applications. With increased MMA content, the resulting materials exhibit remarkable strength and transparency. Conversely, a higher proportion of styrene enhances hydrophobicity, hardness, and impact resistance. The molecular weight plays a crucial role in determining the characteristics of the copolymers. Higher molecular weights, often associated with increased styrene content, yield stronger and more heat-resistant materials. Esschem's ability to manipulate the molecular weight distribution allows for customized properties such as durability, elasticity, and processing ease. Additionally, the particle size of the copolymers influences surface properties and rigidity.

Esschem EMA - EHMA Bead Copolymers are a unique combination of ethyl methacrylate (EMA) and 2-ethylhexyl methacrylate (EHMA) that offers exceptional properties.The incorporation of 2-EHMA disrupts the polymer chain packing, resulting in lower glass transition temperatures and enhanced low-temperature flexibility, while significantly improving transparency.With variations in molecular weight, Esschem can further enhance the strength and flexibility of these bead copolymers. The smaller particle size of the beads improves processability and has the potential to enhance transparency, while larger particles contribute to a more rigid material.

Esschem MMA - IBOMA Bead Copolymers are a range of copolymers that combine methyl methacrylate (MMA) with isobornyl methacrylate (IBOMA).These bead copolymers offer exceptional strength and performance for a wide range of industries. With their high glass transition temperature, melting point, and tensile strength, they provide incredibly strong polymers that meet demanding application requirements.By controlling the molecular weight, Esschem ensures that the copolymer beads exhibit enhanced strength and rigidity. Furthermore, the performance characteristics, including adhesion, can be tailored by optimizing the particle size.

Esschem MMA - AMA Bead Copolymers are a versatile range of copolymers combining methyl methacrylate (MMA) with allyl methacrylate (AMA). These copolymers showcase the unique characteristics of AMA as a crosslinker in polymers. With varying MMA and AMA concentrations, Esschem offers a wide range of copolymer beads with different properties. Higher MMA content in the copolymer results in elevated glass transition temperatures, melting points, and tensile strengths, making them ideal for applications requiring high strength and rigidity. On the other hand, increasing the AMA content lowers these properties while enhancing crosslinking and hardness. By adjusting the molecular weight, Esschem can further customize the copolymer's rigidity and crosslinking behavior. The particle size of the beads can also be modified to optimize processing and surface properties, including adhesion characteristics.

Esschem EMA Bead Copolymers are a range of bead polymers synthesized from ethyl methacrylate (EMA) that offers the strength of polymethyl methacrylate (PMMA) with slightly different properties.The copolymers exhibit a slightly lower glass transition temperature, resulting in a softer and more flexible final product compared to PMMA.By controlling the molecular weight, Esschem can customize the heat resistance and strength of the polymer, making it suitable for various applications across multiple industries.The smaller particle size of the beads enhances surface properties like adhesion, while larger particles contribute to a more robust and rigid material.

Esschem MMA - HPMA Bead Copolymers are a versatile range of copolymers combining methyl methacrylate (MMA) with hydroxypropyl methacrylate (HPMA). These bead copolymers offer exceptional performance and customizable properties for various applications. With increased MMA content, these copolymers exhibit elevated glass transition temperatures, melting points, and tensile strengths, providing enhanced strength and durability. Conversely, higher HPMA content improves adhesion and reduces glass transition temperatures, melting points, and tensile strengths, offering flexibility and tailored characteristics. Esschem further enhances the molecular weight of these copolymers, resulting in more rigid and durable materials. By manipulating the particle size, solubility, dispersion properties, and transparency can be optimized, making them ideal for applications that demand transparency, strength, and toughness.

Esschem EMA - EGDMA Bead Copolymers are a versatile combination of ethyl methacrylate (EMA) and ethylene glycol dimethacrylate (EGDMA). With a higher proportion of EMA, these copolymers exhibit enhanced flexibility due to the less bulky ethyl group present in EMA. Conversely, increasing the EGDMA content results in a more crosslinked structure, leading to greater rigidity. The glass transition temperature remains relatively stable regardless of the percentage of each constituent. By precisely controlling the molecular weight, Esschem can optimize the level of crosslinking, resulting in superior mechanical properties such as hardness and tensile strength. Additionally, the particle size can be tailored to influence surface area and reactivity, allowing for further adjustment of the physical properties.

Esschem MMA - EMA Bead Copolymers are a range of bead copolymers combining methyl methacrylate (MMA) with ethyl methacrylate (EMA). These copolymers exhibit high glass transition temperatures, melting points, and tensile strengths, making them ideal for industries that demand strength and rigidity. By increasing the EMA content, the copolymers offer greater flexibility and the potential for enhanced optical properties. This results in lower glass transition temperatures, melting points, and tensile strengths, providing desired flexibility and transparency. Esschem provides control over the molecular weight to further enhance these properties, allowing for a more rigid and robust copolymer or targeting flexibility and transparency as needed. Particle size control enables fine-tuning of processability and adjustment of surface properties, leading to better performance in applications that prioritize transparency.