Products in Bonding & Assembly: Epoxy & Epoxy Derivatives

EPOXIBOND™ EB-107LP-1 is a two component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties.

EPOXIBOND™ EB-107LP-2 is a two component - optical, medical, and semiconductor grade epoxy resin, with low viscosity, long pot-life, and good handling characteristics.

SetWORX™ U-47MP is a two component, urethane adhesive & encapsulating material which cures to a resilient polyurethane polymer. It finds use as an adhesive, potting and encapsulating material. U-47MP provides a sag resistent bead when dispensed and delivers excellent adhesion to many materials including metals, glass and engineering plastics.

Epic Resins Epic S7045 is a two component, extremely fast-curing epoxy adhesive. The 1 to 1 mix ratio, rapid cure and good adhesion offered by this epoxy resin adhesive system make it ideal for many applications. This epoxy adhesive is particularly useful for field repairs. Epic S7045 adhesive is recommended for any application requiring bonding of wood, metal, plastics and/or concrete.

Epic Resins Epic 0193 is a one component epoxy adhesive. Epic 0193 epoxy adhesive has been designed as a non-sagging thixotropic paste that is resilient and offers good resistance to gasoline and oils. Epic 0193 epoxy adhesive is recommended when bonding materials in environments that see moderate temperatures and severe vibration.

Epic Resins Epic S7422 is a two component epoxy compound designed with a short pot life and anti-sag properties. Epic Resins S7422 is recommended in applications where quick turn over of parts is desired as well as good chemical resistance is needed.

C-POXY 30 is a general purpose, structural, unfilled, fast-setting epoxy adhesive. Recommended for bonding metal, ceramics, stone, glass, concrete, wood, fiberglass and many plastics such as polyester, ABS and rigid PVC (not suitable for PTFE-PP-PE and rubbers).

CoatOSil™ MP 200 silane promotes adhesion in a broad range of applications via multiple epoxy and silane groups on each oligomer chain. Its gamma-gylcidoxy propyl epoxide ring reacts with many organic groups while its alkoxy silane groups promote adhesion to inorganic substrates. Condensation of its silanol groups can also provide crosslinks between polymer chains.

RECKLI Epoxy GF Filler is a pasty, glass fiber reinforced, solvent-free twocomponent epoxy resin with high impact resistance as well as compressive- and flexural strength. It is almost shrinkage-free and insensitive to moisture, thus being applicable on slightly humid surfaces. The addition of further filling material is not recommended.

C-POXY 15 is a general-purpose, unfilled, fast-setting epoxy adhesive. Recommended for bonding metal, ceramics, stone, glass, concrete, wood, fiberglass and many plastics such as polyester, ABS and rigid PVC (not suitable for PTFE-PP-PE and rubbers).

Silquest™ A-186 silane adhesion promoter, can result in better electrical and/or mechanical properties in a variety of applications and industries. From enhancing electronic encapsulants to enabling improved sealant formulations, Silquest™ A-186 silane provides both epoxy and silane functionalities that promote adhesion in a range of formulations, including SPUR+ prepolymer, urethane, epoxy, silicone, and acrylic caulks, coatings, sealants and adhesives.

Epoxy Flex-Filler is a pasty, solvent-free, fast curing two-component epoxy resin, almost shrinkage-free. It is compatible with common epoxy resin coatings.

EPOTUF® 38-694 is an aqueous dispersion of an epoxy ester resin designed to formulate with lower co-solvent demand than standard water reducible epoxy ester resins. EPOTUF® 38-694 is an extremely stable water soluble resin giving up to 20 plus weeks in a white enamel at 120 F. This resin can be used in high gloss enamels or primers

Silquest™ A-1871 Epoxy Silane is a gamma-Glycidoxypropyltriethoxysilane. Acts as adhesion promoter. This epoxy functional silane provides outstanding chemical resistance, mechanical properties, improved adhesion to glass and metal substrates. It also provides crosslinking of waterborne latexes and dispersions; acrylic, styrene acrylic or other copolymers, polyurethane or epoxy dispersions. Has enhanced electrical properties of epoxy based electronic encapsulants and packaging materials, resulting from improved bonding between resin, substrate or filler. Improved wet adhesion reduces the risk of semiconductor or integrated circuit failure as a result of water ingress or surface corrosion. It also has improved dry adhesion and tensile strength. Use of epoxy silane may avoid the yellowing sometimes seen when amino functional adhesion promoters are used and it also has improved shelf stability over aminosilane alternatives. It is used in caulking applications.

Addison Clear Wave Coatings AC A1428 is a UV-curable epoxy sealant.

EPOTUF® 38-406 is an epoxy ester resin supplied at 60% solids in mineral spirits.

EPOTUF® 38-505 is a solvent cut of EPOTUF® 37-001 at 75% solids in xylene

C-POXY 5 is a general-purpose, structural, unfilled, fast-setting epoxy adhesive. It is recommended for bonding metal, ceramics, stone, glass, concrete, wood, fiberglass and many plastics such as polyester, ABS, rigid PVC (not suitable for PTFE-PP-PE and rubbers). It is extremely durable, has a consistent thickness, is water and impact resistant.

Injection Resin EP is a transparent, solvent-free, particularly low-viscous two-component epoxy resin with long processing time.