Products in Packaging & Assembly: Bisphenol Epoxy Resins

ALBIFLEX® 297 is a bisphenol-A-epoxy-silicone block copolymer resin that excels in crafting high-performance elastomers. This versatile liquid, responsive to epoxy, seamlessly cures when combined with aliphatic and cycloaliphatic epoxy resin curing agents. ALBIFLEX® 297 accommodates various conventional casting and molding techniques for your manufacturing needs.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

Epilox T 19-27 is a liquid and solventless blend of standard bisphenol A and bisphenol F epoxy resins with good resistance to crystallization.

BB Resins BB-EPA 1100 is a medium viscosity unmodified epoxy resin obtained by blend of Bisphenol A/Bisphenol F based resins.

Epilox A 17-01 is a colorless, low-molecular-weight bisphenol A epoxy resin.

Epilox A 19-03 is a medium viscosity bisphenol A epoxy resin which may crystallize on storage.

EPOTUF® 37-127 is a low viscosity 100% reactive diluted liquid epoxy resin based on Bisphenol A and which contains EPOTUF® 37-058 (C12 - C14 glycidyl ether).

Epilox A 19-04 is a low molecular weight bisphenol A epoxy resin with medium viscosity.

Epilox AF 18-50 is a liquid and solventless blend of standard bisphenol A and bisphenol F epoxy resins with good resistance to crystallization.

Epilox F 16-01 is a colorless, low-molecular-weight bisphenol F epoxy resin.

Epilox AF 18-30 is a liquid and solventless blend of standard bisphenol A and bisphenol F epoxy resins with good resistance to crystallization.

EPOTUF® 37-140 is the standard, undiluted, general purpose, diglycidyl ether of Bisphenol-A epoxy resin.

Nuceq PZ A/HD-3404 system has been formulated for the technique of fiberglass laminating, potting and casting, this is a solvent-free system based on epichlorohydrin-bisphenol A epoxy resin.