- Product Type:Adhesive, 2K (2 component) Adhesive, Potting Compound
- Application Area:Semiconductor Die Attach, Optical Applications, Electronic Components, Optoelectronics Devices, Interconnect, Photonic Devices, Medical Applications, Medical Devices
- Compatible Substrates & Surfaces:Metal, Glass, Wood
- Cure Method:Air Dry, Heat Cure
- Chemical Family:Epoxy & Epoxy Derivatives
EPOXIBOND™ EB-109M-11 is a flexible, two components, low viscosity, clear epoxy adhesive for optical, medical, and semiconductor applications. This long working life adhesive can be cured at room temperature or with moderate heat and provides excellent adhesion to glass, quartz, metals, wood and most plastics.