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EPOXIBOND™ EB-119M

1 of 27 products in this brand
EPOXIBOND™ EB-109M-11 is a flexible, two components, low viscosity, clear epoxy adhesive for optical, medical, and semiconductor applications. This long working life adhesive can be cured at room temperature or with moderate heat and provides excellent adhesion to glass, quartz, metals, wood and most plastics.

Product Type: 2K (2 component) Adhesive, Adhesive, Potting Compound

Application Area: Electronic Components, Interconnect, Medical Applications, Medical Devices, Optical Applications, Optoelectronics Devices, Photonic Devices, Semiconductor Die Attach

Compatible Substrates & Surfaces: Glass, Metal, Wood

Cure Method: Air Dry, Heat Cure

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet

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Identification & Functionality

Features & Benefits

Features
  • Low Viscosity & long pot life
  • High temperature applications
  • Tg greater than 100°C
  • Color change

Applications & Uses

Compatible Substrates & Surfaces
Applications
  • Fiber optic terminating
  • Endoscope manufacture and repair
  • Optoelectronics
  • High temperature, high performance bonding
  • Electronic sealing
Instructions for Use
  • Weigh each 100 grams of EB-119M to 5 grams of Hardener EH-42LV-1.
  • Mix until uniform. Scrape the sides and bottom of container repeatedly during mixing.
  • Apply to clean bonding surfaces and cure as recommended to achieve the desired properties.
  • Typical cured properties were determined using recommended cure schedule.
  • Some difference in properties may occur with the alternate or other cure schedules.

Properties

Typical Cured Properties
ValueUnitsTest Method / Conditions
Specific Gravity1.18
Hardness91Shore D
Linear Shrinkage0.08%
Lap Shear Strength to Aluminium (at 25°C)2000psi
Lap Shear Strength to Aluminium (at 100°C)1300psi
Service Temperature Range-55 to 230°C
Glass Transition Temperature (Tg)158°C
Coefficient of Linear Thermal Expansion (Below Tg)3810⁻⁶/°C
Coefficient of Linear Thermal Expansion (Above Tg)17410⁻⁶/°C
Dielectric Strength480Volts/mil
Dielectric Constant (at 1 kHz)3.8
Dissipation Factor (at 1 kHz)0.009
Volume Resistivity8x10¹⁵ohm-cm
Handling Properties
ValueUnitsTest Method / Conditions
EpoxibondEB-119M
HardenerEH-42LV
Mix Ratio by Weight (Adhesive/Hardener)100/5
Mixed Viscosity (at 25°C)800 - 1200cps
Pot Life (at 25°C, 100 grams)min. 8hours
Note

Typical Cured Properties After Cure : Tested at 25°C unless otherwise indicated
 

Regulatory & Compliance

Certifications & Compliance

Technical Details & Test Data

Curing Information

Cure Schedules: (Bondline Temperature)

  • < 5 minutes at 175°C
  • 5 minutes at 150°C
  • 15 minutes at 125°C
  • 30 minutes at 100°C

Use any of the above cure schedules. 

Frozen Adhesive

Thaw premixed frozen adhesive at room temperature for 5-10 minutes. Dispense adhesive and cure at recommended schedules.

Safety & Health

Safety Information
  • For Industrial Use Only : Practices of good housekeeping, safety and cleanliness should be followed before, during and after use
  • Warning : Adequate ventilation of workplace and ovens is essential. Refer to Material Safety Data Sheet (MSDS) for additional health and safety information.

Packaging & Availability

Packaging and Availability
  • 2 parts Kit : Packaged in Pint, Quart, Gallon, and 5-Gal
  • Premixed and frozen : Packaged in 3cc, 5cc, 10cc and 30cc disposable syringes and ship in dry ice at -80°C

Storage & Handling

Shelf Life
1 Year
Storage & Shelf Life

One year when stored in unopened containers at an average temperature of 25°C.