- Product Type:Adhesive, 2K (2 component) Adhesive, Potting Compound, Encapsulant
- Application Area:Optical Applications, Electronic Components, Optoelectronics Devices, Semiconductors, Measuring Instruments, Medical Applications
- Compatible Substrates & Surfaces:Metal, Glass, Wood, Plastics
- Cure Method:Air Dry, Heat Cure
- Chemical Family:Epoxy & Epoxy Derivatives
EPOXIBOND™ EB-155 is an undiluted, unfilled, low viscosity clear epoxy system that exhibits exceptional resistance to impact and thermal shock. This system has low exotherm and long work life. Applications includes, high bond strength adhesive for most similar and dissimilar substrates; LED displays, any fiber optic application. It can also be used for making in-place laminates or for protective coating on metals etc. Also it can be used for semi-rigid, moisture proof, gas tight seals between plastic and metallic or other substrates. This is also recommended for potting devices such as connector shells from which rigid or flexible wires may protrude directly through the epoxy.