Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Features
- Excellent impact/vibrations resistance.
- Low stress adhesive for bonding optics inside OEM / scientific instruments
Applications & Uses
- Applications
- Application Area
- Applications
- Potting, casting, encapsulation and bonding applications
- For LCD optical lamination and sealing of glass plates & for LED encapsulation
- Semiconductor applications: underfill for flip chips, glob top encapsulation over wire bonds, spin coating at wafer level.
- Fiber optic adhesive : bundling fibers, terminating fiber into ferrule, adhesive for mounting optics inside fiber components
- Instructions for Use
- Weigh each 100 grams of RESIN, EB-109M-11 to 30 grams of Hardener EH-21LP.
- Mix until uniform. Scrape the sides and bottom of container repeatedly during mixing.
- Apply to clean bonding surfaces and cure as recommended to achieve the desired properties.
- Typical cured properties were determined using recommended cure schedule.
- Some difference in properties may occur with the alternate or other cure schedules.
Properties
- Typical Cured Properties
- Handling Properties
- Note
Typical Cured Properties After Recommended Cure : Tested at 25°C unless otherwise indicated
| Value | Units | Test Method / Conditions | |
| Specific Gravity | 1.16 | — | — |
| Hardness | 40 - 60 | Shore D | — |
| Water Absorption (24 hours Submersion at 25°C) | max. 1 | % | — |
| Lap Shear Strength to Aluminium | max. 1000 | psi | — |
| Service Temperature Range | -55 to 90 | °C | — |
| Glass Transition Temperature (Tg) | max. 30 | °C | — |
| Coefficient of Linear Thermal Expansion (From -60°C to 25°C) | min. 100 | 10⁻⁶/°C | — |
| Dielectric Strength | 420 | Volts/mil | — |
| Dielectric Constant (at 1 kHz) | 3.8 | — | — |
| Dissipation Factor (at 1 kHz) | 0.012 | — | — |
| Volume Resistivity | 8x10¹⁴ | ohm-cm | — |
| Value | Units | Test Method / Conditions | |
| Adhesive | EB-109M-11 | — | — |
| Hardener | EH-21LP | — | — |
| Mix Ratio by Weight (Adhesive/Hardener) | 100/30 | — | — |
| Mixed Viscosity (at 25°C) | 200 - 600 | cps | — |
| Pot Life (at 25°C, 100 grams) | min. 4 | hours | — |
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Curing Information
- Recommended Cure : 3 hrs at 65°C
- Alternate Cure : 24-48 hrs at 25°C
- Frozen Adhesive
Thaw premixed frozen adhesive at room temperature for 5-10 minutes. Dispense adhesive and cure at recommended schedules.
Safety & Health
- Safety Information
- For Industrial Use Only : Practices of good housekeeping, safety and cleanliness should be followed before, during and after use
- Adequate ventilation of work place and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. Refer to Material Safety Data Sheet (MSDS) for additional health and safety information.
Packaging & Availability
- Availability
- 2 parts Kit : Packaged in Pint, Quart, Gallon, and 5- Gallon size.
- Premixed and frozen : Packaged in 3cc, 5cc, 10cc and 30cc disposable syringes and ship in dry ice at -80°C.
Storage & Handling
- Shelf Life
- 1 Year (Two Parts Kit at 25°C), 1 Year (Frozen at -40°C)