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Thermoset Resins
Products in Thermoset Resins
922 Products found in Thermoset Resins
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Cosmic Plastics
DAP 306.0
Polymer Name:
Diallyl Phthalate
End Uses:
Cups, Cases, Encapsulant, Insulators, Terminal Blocks, Switches
Density:
1520.0 - 1520.0 kg/m³
Tensile Strength:
24.804000000000002 - 34.45 MPa
DAP 306 is a general-purpose diallyl ortho-phthalate molding compound filled with Orlon and supplied in flake form. It is suitable for a variety of applications, including switches, terminals, insulators, cups, cases, and other components that require strength as well as chemical and moisture resistance. It can also be used for the encapsulation of electrical and electronic components.
Cosmic Plastics
Cosmic Alkyd 3D94
Polymer Name:
Alkyd Resin
Physical Form:
Sheets
Features:
Low Odor, Easy To Mold
Density:
1890.0 - 1890.0 kg/m³
Color:
Green
Cosmic Alkyd 3D94 is a mineral-filled polyester molding compound that is available in sheet form. This compound is designed for ease of use in molding applications and can be readily molded using standard compression or transfer equipment. It offers good moldability, making it suitable for a range of applications where a combination of mechanical strength and cost-effectiveness is desired. When stored at temperatures of 50°C or below, it has a shelf life of six months, providing flexibility in manufacturing and storage.
Cosmic Plastics
Cosmic Epoxy E4920AC
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Cosmic Epoxy E4920AC is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and is offered in various colors. This product features a mild odor and is insoluble in water, making it suitable for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.
Cosmic Plastics
DAP K66/6230F
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Transfer Molding
End Uses:
Housings, Structural Parts, Insulators, Terminal Blocks, Switches
Density:
1820.0 - 1820.0 kg/m³
Tensile Strength:
0.04134 - 68.9 MPa
DAP K66/6230F is a versatile diallyl iso-phthalate molding compound that incorporates long glass fibers for enhanced strength and flame retardant properties. Supplied in flake form, it is designed for ease of use in molding applications. This compound can be readily preformed and molds easily using standard compression or transfer equipment, making it a flexible choice for various applications. Notably, it has passed NASA outgassing tests, indicating its suitability for applications with stringent outgassing requirements, particularly in industries like aerospace where such standards are critical.
Cosmic Plastics
Farboset® 2460
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Capacitors, Resistor Network, Resistor, Coils, Encapsulant
Volume Resistivity:
18000000000000.0 - 18000000000000.0 Ohm-m
Flexural Strength:
1372.0 - 1372.0 MPa
Farboset® 2460 is a novolac epoxy molding compound filled with minerals. It is designed for encapsulating a variety of electrical and electronic components, including tantalum and ceramic capacitors, resistors, resistor networks, and high-performance coils. This compound is formulated to provide fast cure rates, excellent moldability, and superior resistance to thermal shock and moisture. It has been specifically designed to offer improved resistance to moisture ingress, making it a reliable choice for applications where moisture resistance is crucial.
GAC Chemical
Aqua Aide™ Crystals
Ingredient Name:
Ammonium Sulfate
Chemical Name:
Ammonium Sulfate
CAS Number:
7783-20-2
Functions:
Resin, Stabilizer
Chemical Family:
Sulfates, Ammonium Compounds, Ammonium Salts
Synonyms:
(NH4)2SO4, Ammonium Sulphate, Diammonium Sulfate
Aqua Aide™ Crystals serve as a stabilizer in food products. These crystals possess stabilizing properties and are water-soluble. Additionally, they are odorless and easy to handle. Aqua Aide™ Crystals are also labeled as Kosher.
Cosmic Plastics
DAP D45
Polymer Name:
Diallyl Phthalate
End Uses:
Structural Parts, Insulators, Terminal Blocks, Housings
Density:
1740.0 - 1740.0 kg/m³
Tensile Strength:
31.005000000000003 - 41.34 MPa
DAP D45 is a mineral-filled, flame retardant, general-purpose diallyl ortho-phthalate molding compound supplied in a free-flowing granular form. It offers a cost-effective solution while maintaining essential properties such as high dimensional stability, arc resistance, and excellent dielectric strength. This compound is well-suited for structural parts, housings, terminals, insulators, and other applications where both strength and economy are important factors.
Cosmic Plastics
Cosmic Epoxy EH21
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Compression Molding, Transfer Molding
End Uses:
Encapsulant, Inductor, Core Rods
Cosmic Epoxy EH21 is an iron-filled epoxy molding compound provided in a black granular form. It is well-suited for applications requiring EMI (Electromagnetic Interference) and RFI (Radio-Frequency Interference) shielding. This material can be molded through compression or transfer molding processes to create core rods or to encapsulate surface mount and axial leaded inductors. It offers the advantage of simplifying the molding process by eliminating the need for labor-intensive over/under molding.
Cosmic Plastics
Farboset® 2477CU
Polymer Name:
Epoxy Resins & Compounds
Farboset® 2477CU is designed for use as a compound in thermoset molding. It is available in a solid form, presented as granules, with a granular appearance and a mild odor. This product is insoluble in water and does not exhibit reactivity under normal conditions. It is well-suited for a variety of thermoset molding applications, ensuring safety and reliability in its intended use.
Cosmic Plastics
Cosmic Epoxy EH40
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Inductor, Core Rods, Encapsulant
Cosmic Epoxy EH40 is an iron-filled epoxy molding compound available in a black granular form. It is suitable for EMI/RFI shielding applications and can be used for compression or transfer molding to create core rods or encapsulate surface mount and axial leaded inductors. This material simplifies the manufacturing process by allowing for single molded applications, eliminating the need for labor-intensive over/under molding.
Cosmic Plastics
DAP D72/6120F
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Injection Molding, Transfer Molding
End Uses:
Cups, Cases, Encapsulant, Insulators, Terminal Blocks, Switches
Density:
1820.0 - 1820.0 kg/m³
Tensile Strength:
0.0414 - 69.0 MPa
DAP D72/6120F is a versatile diiallyl ortho-phthalate molding compound, filled with short glass fibers and featuring flame retardant properties. Supplied in a free-flowing granular form, this compound is well-suited for a variety of molding applications. It can be easily molded using compression, transfer, or injection equipment and can be preformed with ease. An important distinction is that it has passed NASA outgassing tests, indicating its suitability for applications with stringent outgassing requirements, particularly in industries like aerospace where such standards are critical.
Cosmic Plastics
Cosmic Epoxy EH31
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Inductor, Core Rods, Encapsulant
Cosmic Epoxy EH31 is an iron-filled epoxy molding compound available in a granular form with a black color. This material is designed for EMI/RFI shielding applications. It can be used for compression or transfer molding to create core rods and encapsulate surface mount and axial leaded inductors. Using this single molded compound can streamline the manufacturing process and eliminate the need for labor-intensive over/under molding.
Cosmic Plastics
Farboset® 2720
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Resistor, Capacitors, Resistor Network, Encapsulant
Farboset® 2720 is a mineral-filled epoxy molding compound known for its rapid curing, exceptional moldability, and remarkable resistance to thermal shock and moisture. This compound is tailored to offer enhanced protection against moisture ingress and boasts a high glass transition temperature, making it an ideal choice for ensuring reliability in performance. Its primary purpose is to encapsulate a wide variety of electronic devices, including tantalum and ceramic capacitors, resistors, and resistor networks, providing them with a robust shield against environmental factors and mechanical stress.
Cosmic Plastics
Cosmic Epoxy CP7311
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Aircraft Applications
Flexural Strength:
0.24115 - 310.05 MPa
Cosmic Epoxy CP7311 is a long-glass reinforced epoxy molding compound that comes in a flake form. It is designed to be an ideal replacement for various aircraft and heavy metal parts, providing a durable and high-strength material suitable for demanding applications in these industries.
Cosmic Plastics
DAP K61/6230
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Transfer Molding
End Uses:
Cups, Housings, Cases, Insulators, Terminal Blocks, Switches
Density:
1720.0 - 1720.0 kg/m³
Tensile Strength:
41.34 - 68.9 MPa
DAP K61/6230 is a general-purpose diallyl iso-phthalate molding compound that contains long-glass fiber fillers. It is supplied in flake form, making it suitable for various molding applications. This compound can be preformed and easily molded using standard compression and transfer equipment. It offers good moldability and is designed to meet the requirements of general-purpose molding applications where a balance of mechanical strength and ease of processing is essential.
Cosmic Plastics
Farboset® 1160
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Power Transformers, Capacitors, Coils, Relay Bases, Encapsulant, Diodes
Volume Resistivity:
95000000000000.0 - 95000000000000.0 Ohm-m
Flexural Strength:
118.58 - 118.58 MPa
Farboset® 1160 is a granular, mineral-filled, anhydride epoxy molding compound designed for the encapsulation of various electrical and electronic components. It offers fast cure rates, long flow, and excellent thermal shock resistance. This compound is suitable for applications involving the encapsulation of coils, transformers, capacitors, diodes, relays, and other components that require good hot rigidity during the molding process.
GAC Chemical
GAC Chemical Ammonium Sulfate Reagent/ACS Grade
Chemical Name:
Ammonium Sulfate
CAS Number:
7783-20-2
Functions:
Stabilizer, Resin
Chemical Family:
Sulfates, Ammonium Compounds, Ammonium Salts
Synonyms:
(NH4)2SO4, Ammonium Sulphate, Diammonium Sulfate
GAC Chemical Ammonium Sulfate Reagent/ACS Grade meets reagent/ACS grade specifications, is certified kosher, and boasts high purity. Available in granular form, it is part of their processing, purification, and testing solutions range, specifically within testing solutions for pharmaceuticals and nutraceuticals.
Metton America
METTON® LMR High-HDT Grade M3000-TH Polymers
Polymer Name:
Polydicyclopentadiene (PDCPD)
Processing Methods:
Injection Molding, Reaction Injection Molding (RIM)
Density:
1030.0 - 1030.0 kg/m³
METTON® LMR High-HDT Grade M3000-TH Polymers are tough and durable engineering plastics (poly-DCPD). They offer part design freedom with integrated functionality and part consolidation opportunities, similar to injection molding, as a replacement for traditional materials like wood and metal. The low-pressure molding process is ideal for producing large plastic parts used in heavy trucks, agriculture, construction, the military, and other industrial applications.
Cosmic Plastics
Farboset® 1115
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Injection Molding, Transfer Molding
End Uses:
Coils, Encapsulant, Power Transformers, Bushings, Switches
Volume Resistivity:
50000000000000.0 - 50000000000000.0 Ohm-m
Flexural Strength:
123.97 - 123.97 MPa
Farboset® 1115 is a granular, mineral-filled, anhydride epoxy molding compound with fast cure rates and excellent hot strength. It is specially designed for encapsulating various electrical and electronic components, including coils, transformers, bushings, switches, and more. The material offers good hot rigidity during the molding process and is commonly used in injection and transfer molding applications.
Cosmic Plastics
Cosmic Epoxy CP7314
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Aircraft Applications
Cosmic Epoxy CP7314 is a long-glass reinforced epoxy molding compound provided in flake form. This material is well-suited for serving as a replacement for a wide range of aircraft and heavy metal parts, offering enhanced durability and strength for demanding applications in these industries.
Cosmic Plastics
Farboset® 2461
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Capacitors, Resistor Network, Resistor, Encapsulant, Inductor Coil
Volume Resistivity:
22000000000000.0 - 22000000000000.0 Ohm-m
Flexural Strength:
85.436 - 85.436 MPa
Farboset® 2461 is a mineral-filled novolac epoxy molding compound that offers fast cure rates, excellent moldability, and superior thermal shock and moisture resistance. It has been formulated to achieve a high glass transition temperature, making it suitable for applications requiring optimal reliability performance, even in very thin sections. Farboset® 2461 is designed for encapsulating a wide range of electronic devices, including capacitors, resistors, resistor networks, and inductor coils, ensuring their protection and reliability in various operating conditions.
Cosmic Plastics
Cosmic Epoxy E4920
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Diodes, Inductor, Rectifier, Encapsulant, Capacitors
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4920 is a mineral-filled epoxy molding compound available either in granular form or preformed in various sizes and weights. It features excellent moisture resistance, thermal cycling stability, and remarkable moldability. Furthermore, parts molded from this material do not support fungus growth, and it is specifically designed for the encapsulation of passive devices, including capacitors, inductors, diodes, and rectifiers.
Cosmic Plastics
Farboset® 2510
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant, Capacitors
Farboset® 2510 is a mineral-filled, novolac epoxy molding compound known for its fast cure rates at low temperatures, excellent laser markability, and good moldability. This compound is specially formulated for encapsulating surface mount ceramic and tantalum capacitors, as well as other applications that demand quick cycle times. Its unique properties and rapid curing make it well-suited for applications where fast production and efficient marking are essential.
Cosmic Plastics
Cosmic Epoxy CP7318
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Aircraft Applications
Flexural Strength:
0.12402 - 165.36 MPa
Cosmic Epoxy CP7318 is a long-glass-reinforced epoxy molding compound supplied in flake form. It can be compressed or transfer-moulded and exhibits high physical strength. This material has a shelf life of 12 months when stored at 20°C or lower. It serves as an ideal replacement for numerous aircraft and heavy metal parts.
Cosmic Plastics
Cosmic Epoxy E4920CD
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Cosmic Epoxy E4920CD is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, offered as granules, preforms, or powders, and is available in various colors. This product has a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.
Cosmic Plastics
Cosmic Epoxy EH81
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Inductor, Core Rods, Encapsulant
Cosmic Epoxy EH81 is an iron-filled epoxy molding compound available in a black granular form. It is specifically designed for EMI/RFI shielding applications and can be used in both compression and transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to simplify the manufacturing process by eliminating the labor-intensive over/under molding steps.
Cosmic Plastics
DAP D69/6130
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Transfer Molding
End Uses:
Housings, Structural Parts, Insulators, Terminal Blocks
Density:
1720.0 - 1720.0 kg/m³
Tensile Strength:
0.0414 - 69.0 MPa
DAP D69/6130 is a versatile diallyl ortho-phthalate molding compound with the advantage of being long-glass fiber filled. Supplied in flake form, this compound is convenient to work with. It can be easily molded using compression or transfer equipment and can be preformed for improved handling. Notably, it maintains its performance even when stored at room temperature for up to one year. This makes it a reliable choice for a wide range of applications where long-term performance and ease of use are essential.
Cosmic Plastics
Cosmic Epoxy CP7312
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Aircraft Applications
Flexural Strength:
0.2067 - 275.6 MPa
Cosmic Epoxy CP7312 is a long-glass-reinforced epoxy molding compound supplied in flake form. It can be compression or transfer-moulded and offers high physical strength. This material has a shelf life of 12 months when stored at 20°C or lower. It is an excellent replacement option for a wide range of aircraft and heavy metal parts, making it a versatile choice for various applications.
Cosmic Plastics
DAP ID-50
Polymer Name:
Diallyl Phthalate
Processing Methods:
Transfer Molding, Compression Molding
DAP ID-50 is a general-purpose diallyl ortho-phthalate molding compound filled with Dacron. It is supplied in a granular form and can be easily molded using standard compression or transfer equipment. This type of compound is versatile and suitable for various molding applications.
Esschem
Esschem MMA - Styrene Bead Copolymers
Polymer Name:
Styrene Methyl Methacrylate Copolymer (SMMA)
Functions:
Resin, Impact Modifier, Binder & Resin, Resins, Binders & Matrix Materials
Chemical Family:
Acrylics, Acrylates & Methacrylates, Methacrylates, Styrenics, Styrene-Acrylic Copolymer, Styrene Copolymers, Styrene Methacrylate Copolymer
Physical Form:
Beads, Solid
Labeling Claims:
Biocompatible, Non-Toxic
Esschem MMA - Styrene Bead Copolymers are a versatile range of copolymers combining methyl methacrylate (MMA) and styrene. These bead copolymers offer a wide array of properties and applications. With increased MMA content, the resulting materials exhibit remarkable strength and transparency. Conversely, a higher proportion of styrene enhances hydrophobicity, hardness, and impact resistance. The molecular weight plays a crucial role in determining the characteristics of the copolymers. Higher molecular weights, often associated with increased styrene content, yield stronger and more heat-resistant materials. Esschem's ability to manipulate the molecular weight distribution allows for customized properties such as durability, elasticity, and processing ease. Additionally, the particle size of the copolymers influences surface properties and rigidity.
Cosmic Plastics
Farboset® 1115AC
Polymer Name:
Epoxy Resins & Compounds
Farboset® 1115AC is intended for use as a compound in thermoset molding. It is available in a solid form, presented as granules, with a granular appearance and a mild odor. This product is insoluble in water and does not exhibit reactivity under normal conditions, making it suitable for various thermoset molding applications and ensuring safety and reliability in its intended use.
Esschem
Esschem EMA - EHMA Bead Copolymers
Polymer Name:
EMA/EHMA Copolymer
Functions:
Resin, Binder & Resin, Impact Modifier, Resins, Binders & Matrix Materials
Chemical Family:
Acrylics, Acrylates & Methacrylates, Methacrylates
Physical Form:
Beads, Solid
Labeling Claims:
Biocompatible, Non-Toxic
Esschem EMA - EHMA Bead Copolymers are a unique combination of ethyl methacrylate (EMA) and 2-ethylhexyl methacrylate (EHMA) that offers exceptional properties.The incorporation of 2-EHMA disrupts the polymer chain packing, resulting in lower glass transition temperatures and enhanced low-temperature flexibility, while significantly improving transparency.With variations in molecular weight, Esschem can further enhance the strength and flexibility of these bead copolymers. The smaller particle size of the beads improves processability and has the potential to enhance transparency, while larger particles contribute to a more rigid material.
Esschem
Esschem Bio-plasticized / MMA Bead Polymers
Polymer Name:
Polymethyl Methacrylate (PMMA)
Functions:
Resin, Binder & Resin, Impact Modifier, Resins, Binders & Matrix Materials
Chemical Family:
Acrylic Ester Copolymer, Acrylics, Acrylates & Methacrylates, Methacrylates
Physical Form:
Beads, Solid
Labeling Claims:
Biocompatible, Bio-based, Non-Toxic
Esschem incorporates sustainable plant-based plasticizers into methyl methacrylate MMA bead polymers. These innovative additives are designed to enhance the flexibility and workability of methacrylate-based polymers. By incorporating bio-plasticizers into MMA bead copolymers, the resulting materials exhibit increased flexibility and reduced glass transition temperature, melting points, and tensile strengths.The inclusion of higher molecular weight components contributes to stronger and more heat-resistant materials.Furthermore, the particle size plays a crucial role in surface properties, where smaller particles enhance adhesion while larger particles contribute to robustness and rigidity.
Cosmic Plastics
Cosmic Epoxy E4920AT
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Cosmic Epoxy E4920AT is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and comes in various colors. This product has a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.
Esschem
Esschem MMA - IBOMA Bead Copolymers
Polymer Name:
MMA/IBOMA Copolymer
Functions:
Resin, Binder & Resin, Impact Modifier, Resins, Binders & Matrix Materials
Chemical Family:
Acrylic Ester Copolymer, Acrylics, Acrylates & Methacrylates, Methacrylates
Physical Form:
Beads, Solid
Labeling Claims:
Biocompatible, Non-Toxic
Esschem MMA - IBOMA Bead Copolymers are a range of copolymers that combine methyl methacrylate (MMA) with isobornyl methacrylate (IBOMA).These bead copolymers offer exceptional strength and performance for a wide range of industries. With their high glass transition temperature, melting point, and tensile strength, they provide incredibly strong polymers that meet demanding application requirements.By controlling the molecular weight, Esschem ensures that the copolymer beads exhibit enhanced strength and rigidity. Furthermore, the performance characteristics, including adhesion, can be tailored by optimizing the particle size.
Cosmic Plastics
DAP D44/6160
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Injection Molding, Transfer Molding
End Uses:
Cups, Housings, Cases, Encapsulant, Insulators, Terminal Blocks, Switches
Density:
1740.0 - 1740.0 kg/m³
Tensile Strength:
31.005000000000003 - 41.34 MPa
DAP D44/6160 is a mineral-filled, special-purpose diallyl ortho-phthalate molding compound supplied in a free-flowing granular form. It can be easily molded using compression, transfer, or injection equipment and can be readily preformed. It surpasses all mineral compounds available today in terms of mechanical and electrical properties. It boasts extremely low water absorption, high dielectric strength, and a low dissipation factor, along with high tensile strength, exceptional arc resistance, and excellent resistance to high temperatures.
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