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Knowde-enriched technical product data sheet
Identification & Functionality
- Chemical Family
- Polymer Name
- Plastics & Elastomers Functions
- Technologies
- Product Families
Features & Benefits
Applications & Uses
- Markets
- Applications
- Plastics & Elastomers End Uses
- Plastics & Elastomers Processing Methods
- Processing Guidelines
Material Handling
Maximum Water Content: 0.12%
Aegis® H55C2ZP copolyamide resin is supplied in sealed containers and drying prior to processing is not required. However, high moisture is the primary cause of processing issues. If drying becomes necessary, a dehumidifying or desiccant dryer operating at 80°C (176°F) is recommended. Drying time is dependent on moisture level.
Recommended Melt Temperature Range
Melt Temperature: Recommended range is 230-275°C (446-527°F)
Typical Extrusion Temperature Profile
Barrel: 239-256°C (462-493°F
Adapter: 250-256°C (482-493°F)
Die: 250-256°C (482-493°F)
Process Melt Temperature: 250-260°C (482-500°F)Screw Parameters
Metering Section: 40%
Transition Section: 3 to 4 flights
Feed Section: Balance of screw length
Compression Ratio: 3.5:1 to 4.0:1
L/D Ratio: 24:1Metering Section Flight Depth
Screw Diameter Recommended Depth 1" 0.055" 1.5" 0.060" 2" 0.070" 2.5" 0.080" 3.5" 0.100" 4.5" 0.115" 6" 0.135"
Properties
- Typical Properties
Value Units Test Method / Conditions Extractables max. 0.8 % SOP-702-307 FA Viscosity 53 D-789 Moisture Content max. 0.10 % D-6869 Yellowness Index (YI) max. -1 MCAMD E-313 - Molded Bar Properties
Value Units Test Method / Conditions Tensile Modulus 2,500/850 MPa ASTM D-638 Elongation at Break (Conditioned) min. 200 % ASTM D-638 Tensile Strength at Yield 77/38 MPa ASTM D-638 Elongation at Break (DAM) 37 % ASTM D-638 Flexural Strength 105/33 MPa ASTM D-790 Flexural Modulus 2,504/630 MPa ASTM D-790 Notched Izod Impact 37/320 J/m ASTM D-256 HD (at 0.45 MPa) 133 (271.4) °C (°F) ASTM D-648 HD (at 1.8 MPa) 61 (141.8) °C (°F) ASTM D-648 Mold Shrink - MD (at 48 hrs) 0.94 % ASTM D-955 Mold Shrink - TD (48 hrs) 1.03 % ASTM D-955 Density 1.11 g/cm3 ASTM D-792
Technical Details & Test Data
- Typical Performance Comparison for Aegis® H55C2ZP (30% GF Reinforced Parts)
Items PA6 (H8202NLB) PA66 PA6/66 (H55C2ZP) Remarks Surface Finish O – + Aegis® H55C2ZP yields excellent surface finish for glass-filled molded parts Warpage O – + Significant improvement Shrinkage O – + Improved due to lower crystallinity Toughness O – + Aegis® H55C2ZP exhibits improved toughness in glass-filled applications in wet or dry conditions at normal or low temperatures. Processability O – + Aegis® H55C2ZP can be processed at lower melt temperatures which enables compounding with heat-sensitive additives with decreased degradation Density O O O Similar Strength O + – Similar to baseline (DAM), ~ 10% lower (COND) Modulus O + – Similar to baseline (DAM),~ 15% lower (COND) Thermal Resistance (HDT) O + O Similar to baseline O = Baseline
DAM = Dry as Molded
COND = 2.7% H2 O
Packaging & Availability
- Packaging Information
Aegis® H55C2ZP is a copolyamide compounding grade available today in commercial quantities, and can be supplied in either bag or Gaylord packaging. It is fully qualified in production on our flexible polymerization asset, as well as in downstream use.