Aegis® H55C2ZP is a 2.7 RV, unfilled, medium viscosity, non-lubricated, polyamide 6/66 copolymer for molding or compounding. With a broad processing window and excellent melt fluidity for filling thin sections, it provides exceptional processability. Aegis® H55C2ZP resin combines strength, stiffness and toughness with chemical and abrasion resistance. For glass- or mineral-filled applications, Aegis® H55C2ZP resin also offers superior surface appearance and low warp.
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Identification & Functionality
Aegis® H55C2ZP Features & Benefits
Applications & Uses
Material Handling
Maximum Water Content: 0.12%
Aegis® H55C2ZP copolyamide resin is supplied in sealed containers and drying prior to processing is not required. However, high moisture is the primary cause of processing issues. If drying becomes necessary, a dehumidifying or desiccant dryer operating at 80°C (176°F) is recommended. Drying time is dependent on moisture level.
Recommended Melt Temperature Range
Melt Temperature: Recommended range is 230-275°C (446-527°F)
Typical Extrusion Temperature Profile
Barrel: 239-256°C (462-493°F
Adapter: 250-256°C (482-493°F)
Die: 250-256°C (482-493°F)
Process Melt Temperature: 250-260°C (482-500°F)
Screw Parameters
Metering Section: 40%
Transition Section: 3 to 4 flights
Feed Section: Balance of screw length
Compression Ratio: 3.5:1 to 4.0:1
L/D Ratio: 24:1
Metering Section Flight Depth
| Screw Diameter | Recommended Depth |
| 1" | 0.055" |
| 1.5" | 0.060" |
| 2" | 0.070" |
| 2.5" | 0.080" |
| 3.5" | 0.100" |
| 4.5" | 0.115" |
| 6" | 0.135" |
Properties
| Value | Units | Test Method / Conditions | |
| Extractables | max. 0.8 | % | SOP-702-307 |
| FA Viscosity | 53 | - | D-789 |
| Moisture Content | max. 0.10 | % | D-6869 |
| Yellowness Index (YI) | max. -1 | MCAMD | E-313 |
| Value | Units | Test Method / Conditions | |
| Tensile Modulus | 2,500/850 | MPa | ASTM D-638 |
| Elongation at Break (Conditioned) | min. 200 | % | ASTM D-638 |
| Tensile Strength at Yield | 77/38 | MPa | ASTM D-638 |
| Elongation at Break (DAM) | 37 | % | ASTM D-638 |
| Flexural Strength | 105/33 | MPa | ASTM D-790 |
| Flexural Modulus | 2,504/630 | MPa | ASTM D-790 |
| Notched Izod Impact | 37/320 | J/m | ASTM D-256 |
| HD (at 0.45 MPa) | 133 (271.4) | °C (°F) | ASTM D-648 |
| HD (at 1.8 MPa) | 61 (141.8) | °C (°F) | ASTM D-648 |
| Mold Shrink - MD (at 48 hrs) | 0.94 | % | ASTM D-955 |
| Mold Shrink - TD (48 hrs) | 1.03 | % | ASTM D-955 |
| Density | 1.11 | g/cm3 | ASTM D-792 |
Technical Details & Test Data
| Items | PA6 (H8202NLB) | PA66 | PA6/66 (H55C2ZP) | Remarks |
| Surface Finish | O | – | + | Aegis® H55C2ZP yields excellent surface finish for glass-filled molded parts |
| Warpage | O | – | + | Significant improvement |
| Shrinkage | O | – | + | Improved due to lower crystallinity |
| Toughness | O | – | + | Aegis® H55C2ZP exhibits improved toughness in glass-filled applications in wet or dry conditions at normal or low temperatures. |
| Processability | O | – | + | Aegis® H55C2ZP can be processed at lower melt temperatures which enables compounding with heat-sensitive additives with decreased degradation |
| Density | O | O | O | Similar |
| Strength | O | + | – | Similar to baseline (DAM), ~ 10% lower (COND) |
| Modulus | O | + | – | Similar to baseline (DAM),~ 15% lower (COND) |
| Thermal Resistance (HDT) | O | + | O | Similar to baseline |
O = Baseline
DAM = Dry as Molded
COND = 2.7% H2 O
Packaging & Availability
Aegis® H55C2ZP is a copolyamide compounding grade available today in commercial quantities, and can be supplied in either bag or Gaylord packaging. It is fully qualified in production on our flexible polymerization asset, as well as in downstream use.