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AI Technology CXP 7686-UF

Product Type: Underfill Adhesive

Application Area: Reflow Soldering

Compatible Substrates & Surfaces: Semiconductor Wafer

    Knowde Enhanced TDS

    Identification & Functionality

    Product Type

    Features & Benefits

    Applications & Uses

    Application Area
    Compatible Substrates & Surfaces

    Regulatory & Compliance

    Certifications & Compliance