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AI Technology CXP 7868

Product Type: Adhesive

Application Area: Die/Chip Attach, Reflow Soldering, Wire Bonding

Compatible Substrates & Surfaces: Semiconductor Wafer

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Knowde Enhanced TDS

Identification & Functionality

Product Type

Features & Benefits

Applications & Uses

Compatible Substrates & Surfaces

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Electrical Resistivity2x10¹⁴Ω-cm
Thermal Conductivity3.6W/m-°C
Die Shear Strength2000psi
Glass Transition Temperature240°C

Regulatory & Compliance

Certifications & Compliance