Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Technologies
Features & Benefits
- Ready-to-Use Product Features
- Product Highlights
- Snap Curing
- Solvent Free, Thixotropic
- Electrically Insulating
- Epoxy Paste Adhesive
- <20 ppm lonic Impurities
Applications & Uses
- Markets
- Application Area
- Applications
- Large Area Die Attach
- Component Attach Including SMT
- Substrate Attach
- Sealing
- Application Process
- Thaw for 30 minutes before opening jar.
- Dispense adhesive onto clean substrate.
- Cure according to one of the recommended schedules.
Properties
- Physical Form
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Average Viscosity (0.5 rpm, 25°C) | 8000 - 12000 | cp | Brookfield DV-1, Spindle CP51 |
| Cured Density | 1.08 - 1.32 | gm/cc | — |
| Device Push-off Strength | min. 8.3 | N/mm² | — |
| Dielectric Strength | 750.0 | Volts/mil | — |
| Electrical Resistivity (150°C/60 min) | 1x10¹⁴ | ohm-cm | — |
| Glass Transition Temperature | -27.5 to -22.5 | °C | — |
| Hardness (Type) | 54 - 66 | Shore A | — |
| Lap-Shear Strength | min. 6.9 | N/mm² | — |
| Linear Thermal Expansion Coefficient | 102 - 138 | ppm/°C | — |
| Maximum Continuous Operation Temperature | max. 150 | °C | — |
| Thermal Conductivity | 0.18 - 0.22 | W/m-°C | — |
Technical Details & Test Data
- Cure Schedules
Temperature Time 140 C 3 min 160°C 90 sec 180C 30 sec
Packaging & Availability
- Availability
ME7650-RC is available in syringes for automatic needle dispense applications or in jars.
Storage & Handling
- Shelf Life
- 1 year (-40°C), 3 months (0°C), 5 days (25°C)