Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Product Highlights
- Stress Free
- 100% Solid
- Flexible, Reworkable
- Electrically Conductive
- Epoxy Paste Adhesive
Applications & Uses
- Applications
- Large Area Die
- Automated Assembly
- Reworkabililty
- Mismatched CTE'S
- Application Process
- Thaw for 30 minutes before opening jar.
- Dispense adhesive onto clean substrate.
- Cure according to one of the recommended schedules.
Properties
- Physical Form
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Average Viscosity (0.5 rpm, 25°C) | 64000 - 96000 | cp | Brookfield DV-1, Spindle CP51 |
| Cured Density | 3.6 - 4.4 | gm/cc | - |
| Current Carrying Capabilities | 35.0 | Amp/mm² | - |
| Device Push-off Strength | min. 10.4 | N/mm² | - |
| Electrical Resistivity (150°C/60 min) | max. 4x10⁻⁴ | ohm-cm | - |
| Glass Transition Temperature | -22 to -18 | °C | - |
| Hardness (Type) | 81 - 99 | Shore A | - |
| Lap-Shear Strength | min. 6.9 | N/mm² | - |
| Linear Thermal Expansion Coefficient | 102 - 138 | ppm/°C | - |
| Maximum Continuous Operation Temperature | max. 150 | °C | - |
| Thermal Conductivity | 7.11 - 8.69 | W/m-°C | - |
Regulatory & Compliance
- Quality Standards
Technical Details & Test Data
- Cure Schedules
Temperature Time 80°C 16 hr 100°C 8 hr 125°C 4 hr 150°C 2 hr 175°C 30 min
Packaging & Availability
- Availability
ME8155-M is available in syringes for automatic needle dispense applications or in jars.
Storage & Handling
- Shelf Life
- 1 year (-40°C), 3 months (0°C)