Products

EG8050 is an electrically conductive, silver filled epoxy which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). Post bake at 100°c or 125°c for 24 hrs using a vacuum or air flow oven is recommended in order to pass NASA outgassing testing. It can be readily reworked at 80-150°C and is ideal for applications such as large area die attach and substrate attach because of it's ability to bond materials with highly mismatched CTE.

ME8452-A is an accelerated version of ME8452 for snap-curing applications.This novel silver-filled paste is reworkable, solvent free, and electrically and thermally conductive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE'S (i.e., alumina to aluminum, silicon to copper). It can be readily reworked from 80°C to 100°C and is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE.

EG 8050-HC is a more conductive version of EG 8050 which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). It can be readily reworked at 80-150°C and is ideal for applications such as large-area die attach and substrate attach because of it's ability to bond materials with highly mismatched CTE's.

EG8050-LV is an electrically conductive, silver filled epoxy which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). It can be readily reworked at 80-150°C and is ideal for applications such as large area die attach and substrate attach because of it's ability to bond materials with highly mismatched CTE.

TK 7759 is a reworkable, diamond-filled, tacky epoxy film adhesive. It is designed for bonding die, component and substrate to a large and mismatched substrate or carrier. Bonding may be reworked at >80°C. TK 7759 has excellent thermal conductivity. Its low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or shock testing.

ME8155 is a silver filled paste, reworkable, solvent free, and electrically and thermally conductive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). This paste can be used for screen printing and it can be readily reworked at 80-100°C.

ME7158 is a reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The very high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components. It can be readily reworked at 80-150°C with torque or peel stress.

ME 8452 is a reworkable, solvent free, pure silver filled, electrically and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). It can be readily reworked from 80°C to 100°C. It is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE.

Tack-film TK7755 is a reworkable, alumina-filled, epoxy film adhesive. It is designed for bonding components and substrate to a mismatched substrate or carrier. This B-Staged conductive adhesive offers excellent reworkability at 80-150°C and is storable at -40°C for 3 months. Designed to meet the hybrid adhesive specification MIL-STD-883; Method 5011.4, TK7755 exhibits low outgassing at 125°C. TK7755 has excellent thermal conductivity and its low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or shock testing.

RTK7659 is a tack-film, reworkable, diamond-filled, epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier. This B-Staged, dielectric adhesive offers excellent reworkability at 80-150°C. RTK7659 has excellent thermal conductivity and the low Tg of the adhesiveimposes minimum thermal stress on bonded parts during thermal cycling or shock testing.

ME7159 is a reworkable, diamond filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The ultra high thermal conductivity of this diamond filled material makes it useful for bonding high-powered, large area die and components. It can be readily reworked at 80-100°C.

TC8750 is a silver-filled, B-staged epoxy film adhesive. It is designed for bonding component and substrate to a mismatched substrate or carrier. Its low Tg imposes minimum thermal stress on bonded parts during thermal cycling or shock testing. It has excellent thermal conductivity and can be used for most applications at temperatures from -65 to 150°C. It is reworkable at 80-150°C. Customers must test the adhesive for their specific applications to confirm its suitability. TC8750 is designed to meet the hybrid adhesive specification MIL-STD-883; Method 5011. It exhibits low outgassing at 125°C and passes NASA Outgassing requirements.

ME7155 is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits not only outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper), but also exhibits high level of uniformity and consistency in appearance and smoothness of texture, yielding potential ease of use and success in applications. The high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components. MEZ155 can be readily reworked at 80-1502.

Tack-Free ESP8350 is a reworkable, silver-filled, epoxy film adhesive. It is designed for bonding component and substrate to a mismatched substrate or carrier. This novel, B-staged electrically conductive adhesive offers excellent reworkability from 80 to 150°C. The dry, tack-free handling of the film makes it suitable for an automated assembly. ESP8350 has excellent thermal conductivity. Its low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or shock testing. This frilm is reinforced with 1.5 mil fiberglass.

ME7656 is a reworkable, boron-nitride crystallite filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The very high thermal conductivity of this material makes it useful for bonding high- powered, large area die and components.

ME8456 is a reworkable, pure silver filled, electrically and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). It can be readily reworked from 80 to 100°C and is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE's. Meets Mil-Std 883; Method 5011.5 and NASA-ESA Outgassing Requirements.

ME7155-AN is a reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components. It can be readily reworked at 80-100°C.

ME 7155-SC4 is a reworkable, alumina-filled, electrically insulating, and thermally conductive epoxy paste adhesive. It exhibits Outstanding flexibility for bonding materials having highly mismatched CTE's. The high thermal conductivity of this material makes it useful as a thermal bridge between surface mount components and substrates where heat dissipation is critical for thermal management. ME 7155-SC4 cures during the reflow soldering of surface mount components. It can be readily reworked at 80-100°C.

ME7156 is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The high thermal conductivity of this material makes it useful for bonding large area die and components. ME7156 can be readily reworked at 80-100°C. Positive displacement dispensing equipment with ceramic auger is recommended..

EG7658 is a reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (ie., alumina to aluminum, silicon to copper). The high thermal conductivity and flexibility make it excellent for bonding high-powered, large area die and components. EG7658 can be reworked using temperatures higher than the cure temperature from 80-150°C to soften the bond line. Use a tool adequate to break the bond and remove. Clean any residue with a solvent which will not damage the parts.

ME 8155-M is a version of ME 8155 modified to provide extra flexibility while maintaining all electrical and bond strength. It is a reworkable, solvent fsilver-filledilled paste that is electrically and thermally conductive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). This paste can be used for screen printing and it can be readily reworked at 80-100°C.