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AI Technology ME 8456

ME8456 is a reworkable, pure silver filled, electrically and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). It can be readily reworked from 80 to 100°C and is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE's. Meets Mil-Std 883; Method 5011.5 and NASA-ESA Outgassing Requirements.

Product Type: Adhesive, Conductive Adhesive, Epoxy Adhesive

Application Area: Die/Chip Attach

Compatible Substrates & Surfaces: Aluminum, Copper, Metal, Silicon

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Product Highlights
  • Stress Free
  • Reworkable
  • Electrically Conductive
  • Epoxy Paste Adhesive

Applications & Uses

Application Area
Compatible Substrates & Surfaces
Applications
  • Large Area Die
  • Substrate and Component
  • Reworkability
  • Mismatched CTE's
Application Process
  • Thaw sealed at ambient for 30 minutes before using.
  • Dispense adhesive onto clean substrate.
  • Pre-bake dispensed adhesive at 80°C for 30 minutes to achieve optimum bonding. Pre-bake not needed in all applications.
  • Cure according to one of the recommended cure schedules.

Note:

  • For higher temperature curing, above 125°C and/or bonding area of over 1x1sq cm, it is recommended the dispensed adhesive be pre-baked, open faced without parts, at 80°C for 30 minutes before parts are mounted and cured.
  • 24 Hour 125°C or 100°C vacuum or air flow oven post bake required to meet outgassing requirements

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Average Viscosity (0.5 rpm, 25°C)104000 - 156000cpBrookfield DV-1, Spindle CP51
Glass Transition Temperature-22 to -18°C
Current Carrying Capabilities35.0Amp/mm²
Device Push-off Strengthmin. 17.2N/mm²
Electrical Resistivity (150°C/60 min)max. 4x10⁻⁴ohm-cm
Hardness (Type)72 - 88Shore A
Cured Density3.15 - 3.85gm/cc
Lap-Shear Strengthmin. 6.9N/mm²
Thermal Conductivity7.11 - 8.69W/m-°C
Linear Thermal Expansion Coefficient110.5 - 149.5ppm/°C
Maximum Continuous Operation Temperaturemax. 150°C
Pot Life5 days (25°C)

Technical Details & Test Data

Cure Schedules
Temperature Time
80°C 8 hr
100°C 4 hr
125°C 2 hr
150°C 1 hr

 

Note:

  • Recommend using prebake

Packaging & Availability

Availability

ME8456 is available in syringes for automatic needle dispense applications or in jars. Both viscosity and thixotropic index can be modified to your specific needs.

Storage & Handling

Shelf Life
1 year (-40°C)