Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
Features & Benefits
- Ready-to-Use Product Features
- Product Highlights
- Stress Free, Ultra High
- Thermal Conductivity
- Reworkable
- Diamond Filled
- Epoxy Film Adhesive
Applications & Uses
- Applications
- Substrate and Component
- Reworkability
- Mismatched CTE's
- Application Process
- Let adhesive thaw in bag or plastic box, as received, at ambient for 15 minutes.
- Cut to desired size.
- Clean contact surfaces if needed. After step 4, cure using one of the recommended schedules
- Remove one side of the release paper by peeling up a corner of the release paper. Fold the release paper over, approaching a 180 angle. Pull the release paper quickly removing it with one stroke. Apply to substrate, then remove other side of release paper and attach die or component.
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Cured Density | 2.07 - 2.53 | gm/cc | - |
| Device Push-off Strength | 14.94 - 18.26 | N/mm² | - |
| Dielectric Strength | 675 - 825 | Volts/mil | - |
| Electrical Resistivity (150°C/60 min) | min. 1x10¹⁴ | ohm-cm | - |
| Glass Transition Temperature | 22.5 - 27.5 | °C | - |
| Hardness (Type) | 76.5 - 93.5 | Shore A | - |
| Lap-Shear Strength | 6.21 - 7.59 | N/mm² | - |
| Linear Thermal Expansion Coefficient | 93.5 - 126.5 | ppm/°C | - |
| Maximum Continuous Operation Temperature | max. 150 | °C | - |
| Thermal Conductivity | 10.26 - 12.54 | W/m-°C | - |
Regulatory & Compliance
- Quality Standards
Technical Details & Test Data
- Cure Schedules
Temperature Time Pressure 80°C 8 hr 3-5 psi 100°C 4 hr 3-5 psi 125 C 2hr 3-5 psi 150°C 1 hr 3-5 psi
Packaging & Availability
- Availability
TK7759 is available in sheet sizes or as custom preforms. Standard thicknesses are 0.003" and 0.006". Special thicknesses are available.
Storage & Handling
- Shelf Life
- 1 year (-40°C)