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COOL SILVER™ G4

1 of 8 products in this brand
COOL SILVER™ G4 is the fourth generation and a lower themal resistance version of the famed COOL-SILVER grease. It is a non-curing, non- silicone, thermal interface grease that is not electrically conductive. The non-curing COOL SILVER™ G4 is by far the lowest thermal resistance grease that is not electrically conductive. It is designed specifically for high power devices requiring less than 0.0016 °C-in/watt thermal resistance (0.001 inch interface layer). COOL SILVER™ G4 will become slightly more viscous after dispensing. It will remain a thermaly conductive interface medium with non-electrically conductive properties.

Product Type: Grease

Application Area: Wire Bonding

Features: Electrically Insulating, Good Thermal Conductivity, Low Temperature Resistant

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Product Type

Grease

Technologies

Ready-to-Use Products

Product Families

Ready-to-Use Products — Fluids & Lubricants

Greases

Features & Benefits

Ready-to-Use Product Features

Electrically Insulating,

Good Thermal Conductivity,

Low Temperature Resistant

Product Highlights
  • Non curing
  • Electrically non-conductive
  • Outstanding thermal conductivity
  • Interfacial compound

Applications & Uses

Markets

Consumer Goods,

Electrical & Electronics

Applications

Consumer Goods — Appliances & Electronics

Electrical & Electronics — Devices & Assemblies

Consumer Electronics

Application Area

Wire Bonding

Applications
  • Processor to heatspreader interface
  • Processor module to heatsink interface
  • Processor to heatpipe interface
  • Highest power dissipation requirement
Application Process
  • Dispense grease onto clean substrate.
  • Do not dilute COOL-SILVER G4.
  • Try to spread very thin grease material on both sides of the substrate to ensure complete coverage and removal of trapped air.
  • For large area of interfacing, dispense in "star-like" or "cross-like" patten to allow for flow and fill in all sides to see slight filets.

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Average Viscosity (5 rpm, 24°C)40000 - 60000cpBrookfield DV-1, Spindle CP51
Cured Density3.24 - 3.96gm/cc—
Linear Thermal Expansion CoefficientNon-curing——
Maximum Continuous Operation Temperaturemax. 150°C—
Thermal Conductivity12.0W/m-°C—

Technical Details & Test Data

Note
  • COOL-SILVER G4 measured to have the lowest thermal interface resistance on device level test of all thermal greases on the market without exception. Thermal resistance is outstanding as dispensed. The performance may improve slightly over a period of 24 hours.
  • Even though COOL-SILVER G4 is not conductive in bulk, individual particles may be conductive. Spreading to exposed circuit traces should be avoided.

Packaging & Availability

Availability

COOL-SILVER G4 is available in syringes for automatic needle dispensing. For consumer applications, it is packaged in 3.5 gram syringes for ease of dispensing.

Storage & Handling

Shelf Life
1 year (25°C)