Products

ME 8418 is designed for automated, inline processing. This single component, silver filled paste is solvent free, and electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The higher Tg and modulus made it more suitable for bonding smaller devices only. Wire- bonding at temperatures as high as 250°C is permissible. ME 8418 has been designed to eliminate bleeding on both silver plated copper and alloy 42 leadframes.

COOL SILVER™ G5 is an improved version of COOL-SILVER™ G3 and G4. It is a non-curing, non-silicone, thermal interface modified silver-filled grease that is not electrically conductive in bulk. The non-curing COOL SILVER™ G5 is by far the lowest thermal resistance grease that is not electrically conductive when compared with the best of the silver and diamond greases. It is designed specifically for high-power devices requiring less than 0.0015 °C-in²/watt thermal resistance (0.001 inch interface layer). COOL SILVER™ G5 will become a slightly more viscous after dispensing.It will remain as a thermally conductive interface medium with non-electrically conductive properties at all time. Temperatures greater than 100°C, will cause grease to gel.

MC8880 is a one part, silver-filled cyanate ester adhesive that is electrically and thermally conductive. It is designed for use in both chip and component level attach application to reduce stress. It can withstand temperatures up to 300°C without thermal degradation. Its unique chemistry results in very low moisture absoption, high adhesive strength.

ME7857-SC is a medium viscosity, silicon carbide filled, flexible epoxy for snap curing application. It is a reworkable, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility down to -60°C. Ideal for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The stress-free flexible adhesive maintains good stable bond strength of 100 psi from 150-250°C and has outstanding thermal stability.

ME 7155-SC4 is a reworkable, alumina-filled, electrically insulating, and thermally conductive epoxy paste adhesive. It exhibits Outstanding flexibility for bonding materials having highly mismatched CTE's. The high thermal conductivity of this material makes it useful as a thermal bridge between surface mount components and substrates where heat dissipation is critical for thermal management. ME 7155-SC4 cures during the reflow soldering of surface mount components. It can be readily reworked at 80-100°C.

COOL SILVER™ G4 is the fourth generation and a lower themal resistance version of the famed COOL-SILVER grease. It is a non-curing, non- silicone, thermal interface grease that is not electrically conductive. The non-curing COOL SILVER™ G4 is by far the lowest thermal resistance grease that is not electrically conductive. It is designed specifically for high power devices requiring less than 0.0016 °C-in/watt thermal resistance (0.001 inch interface layer). COOL SILVER™ G4 will become slightly more viscous after dispensing. It will remain a thermaly conductive interface medium with non-electrically conductive properties.

ME 8630-SSC is a ultra-fast curing with extra fine silver filled for finer pitch application. It is a low stress, low temperature curable die-attach adhesive paste. This single component, silver filled paste is electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The relatively medium Tg and modulus made it suitable for bonding both smaller and relatively large devices. Wire-bonding at temperatures as high as 250°C is easily achievable. ME 8630-SSC has been designed to eliminate bleeding on both silver plated copper and alloy 42 leadframes.

ME7656 is a reworkable, boron-nitride crystallite filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The very high thermal conductivity of this material makes it useful for bonding high- powered, large area die and components.