- Applications:Printed Circuit Boards (PCBs), Consumer Electronics, Appliances & Electronics
- Product Families:Conductive Adhesives, Adhesives & Sealants
- Chemical Family:Epoxy & Epoxy Derivatives
ME 8418 is designed for automated, inline processing. This single component, silver filled paste is solvent free, and electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The higher Tg and modulus made it more suitable for bonding smaller devices only. Wire- bonding at temperatures as high as 250°C is permissible. ME 8418 has been designed to eliminate bleeding on both silver plated copper and alloy 42 leadframes.