Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Product Highlights
- Snap-Curing
- Solvent-Free, Void-Free
- <20 ppm lonics
- Silver Epoxy
- Conductive Die-Attach Paste
Applications & Uses
- Applications
- Application Area
- Applications
- In-line Die-Attach
- Smaller Dies of 5 mm or less
- Smaller Area Substrate and Component Attaches
- Application Process
- Thaw to ambient temperature for 30 minutes before opening jar or using syringes.
- Dispense adhesive onto clean substrate with a suitable pattern to assure full die coverage.
- Cure according to the recommended schedule.
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Average Viscosity (0.5 rpm, 25°C) | 48000 - 72000 | cp | Brookfield DV-1, Spindle CP51 |
| Cured Density | 3.15 - 3.85 | gm/cc | — |
| Current Carrying Capabilities | 20.0 | Amp/mm² | — |
| Device Push-off Strength | 8.3 | N/mm² | — |
| Electrical Resistivity (150°C/60 min) | max. 4x10⁻⁴ | ohm-cm | — |
| Glass Transition Temperature | 72 - 88 | °C | — |
| Hardness (Type) | 72 - 88 | Shore D | — |
| Linear Thermal Expansion Coefficient | 34 - 46 | ppm/°C | — |
| Maximum Continuous Operation Temperature | max. 150 | °C | — |
| Thermal Conductivity | 3.87 - 4.73 | W/m-°C | — |
Technical Details & Test Data
- Cure Schedules
Temperature Time 150-160°C 60 sec 125°C 5 min 80°C 30 min 60°C 8 hr
Packaging & Availability
- Availability
ME8418 is available in syringes for automatic needle dispense applications or in jars.
Storage & Handling
- Shelf Life
- 1 year (-40°C), 6 days (20°C)