Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Product Highlights
- 100% Solid
- Low Temperature Curable
- Snap-Curable
- Long Pot-Life
- Fine Pitch with Extra-Fine Silver
Applications & Uses
- Applications
- Application Area
- Applications
- In-line Die-Attach
- Large and Small Dies
- Rapid Curing for Smaller Dies (10mm)
- Low Temperature Curing for Large Dies
- Application Process
- Thaw to ambient temperature for 30 minutes before opening jar or using syninges.
- Dispense adhesive onto clean substrate with a suitable pattern to assure full die coverage.
- Cure according to one of the recommended cure schedules.
Properties
- Physical Form
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Average Viscosity (0.5 rpm, 24°C) | 48000 - 72000 | cp | Brookfield DV-1, Spindle CP51 |
| Cured Density | 3.6 - 4.4 | gm/cc | — |
| Current Carrying Capabilities | min. 20 | Amp/mm² | — |
| Device Push-off Strength | min. 10.39 | N/mm² | — |
| Electrical Resistivity (150°C/60 min) | min. 5x10⁻⁴ | ohm-cm | — |
| Glass Transition Temperature | 72 - 88 | °C | — |
| Hardness (Type) | 72 - 88 | Shore D | — |
| Linear Thermal Expansion Coefficient | 34 - 46 | ppm/°C | — |
| Maximum Continuous Operation Temperature | max. 150 | °C | — |
| Thermal Conductivity | 10.35 - 12.65 | W/m-°C | — |
Technical Details & Test Data
- Cure Schedules
Temperature Time 50°C 2 hr 90°C 30 min. 130C 10 min 150°C 5 min - Pot life is 2 Days 25°C min. The adhesive in used syringe may be sealed and stored in freezer for more useful dispensing life.
- For optimum electrical conductivity, post cure the adhesive at 150°C for 2 hours.
Packaging & Availability
- Availability
ME8630-SsC is available in syringes for automatic needle dispense applications or in jars.
Storage & Handling
- Shelf Life
- 1 year (-40°C)