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PAKCOOL® TPC-213

1 of 8 products in this brand
PAKCOOL® TPC-213 is 1:1 two-component liquid electronic potting material, which can be solidified at room temperature or heated change. In addition to high thermal conductivity, this product also has a low thermal expansion rate and high insulation characteristics, so as to more effectively eliminate electronic components destructive effects due to changes in operating temperature.

Product Type: 2K (2 component) Sealant, Potting Compound, Solvent free (100% Solids) Sealant

Application Area: Electrical Components

Cure Method: Heat Cure

Chemical Family: Silicones

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Identification & Functionality

Chemical Family

Features & Benefits

Performance and Features
  • This series of potting glue is suitable for various potting modes
  • Low stress, more effective protection of electrical components
  • 100% solid, no exudate after curing.
  • Excellent high and low temperature resistance, excellent weather resistance and radiation resistance and excellent dielectric properties.
  • Stable chemical and mechanical properties.

This series of products is also widely used for bonding heat-generating electronic devices and heat sinks or metal casings.TPC-213 has excellent flow and leveling properties before curing. It will not come out of the protective shell due to alternating hot and cold use.The potting surface is smooth and free of volatiles. The system has excellent anti-toxicity, under normal circumstances no need for soldering and coatings, etc. for special treatment.

Applications & Uses

Application Area
Cure Method
Application Areas
  • Power module/integrated chip/power module
  • Controller
  • Automobile electronic products
  • Telecommunication equipment
  • LED assembly
  • Computer and its accessories

Properties

Typical Properties
ValueUnitsTest Method / Conditions
A/B Mixing Ratio1:1
Continous Use Temperature-50 to 200°C
Density2.15 - 2.25g/cm³ASTM D792
Dielectric Strengthmin. 18kV/mmASTM D149
Flame RetardantCompliant with V-0UL 94
Hardness40 - 50Shore AASTM D2240
Operating Period (20°C)min. 30
Thermal Conductivity1.2 - 1.4W/m.kASTM D5470
Viscosity (Component A)5000 - 6000CpsBrookfield Viscometer
Viscosity (Component B)200 - 300CpsBrookfield Viscometer
Volume Resistancemin. 3x10¹³Ω∙cmASTM D257

Technical Details & Test Data

Crosslinking/Curing Time

PAKCOOL® TPC-213 silica gel at room temperature for 8 cures naturally within 24 hours. Its cross-linking time will vary with temperature shortening as the temperature increases (see table below)

25°C 24 Hours
70°C 40 Minutes
100°C 25 Minutes
125°C 20 Minutes

Safety & Health

Precautions
  • The thermally conductive potting compound may not cure or finish in contact with some substances fully cured, these substances include: sulfur, phosphorus, nitrogen hydrate water, organic salts, etc. If the operator smokes before operation, because there will be sulfur residues on your hands when you smoke, please wash and dry with soap Use the silicone after cleaning your hands. 
  • Because the viscosity of A/B component is slightly different, if using machine for potting, the pressure of component B needs to be adjusted slightly.
  • Please seal and store, the mixed rubber should be used up at one time, avoid cause waste
  • Keep away from children

Storage & Handling

Shelf Life
12 Months (at less than 20°C)