Products

PAKCOOL® TPC-219 is 1:1 two-component liquid electronic potting material, available at room temperature or warmed under curing. In addition to the characteristics of high thermal conductivity, this product also has thermal low expansion rate and high insulation characteristics, so as to be more effective eliminate the destructive effect of electronic components due to changes in operating temperature.

PAKCOOL® TPC-213-08-DM is a high thermal conductivity Energy efficient 1:1 two-component liquid electronic potting material, available at room temperature or with added cures at temperature.

PAKCOOL® TPC-230 is 1:1 two-component liquid electronic potting material that can be solidified at room temperature or at elevated temperatures change. In addition to the characteristics of high thermal conductivity, this product also has a thermal expansion rate low and high insulation characteristics, which eliminates electrons more effectively. Destruction of components due to changes in operating temperature.

PAKCOOL® TPC-213-08 is 1:1 two-component liquid electronic potting material, available at room temperature or at elevated temperatures damage caused by changes in operating temperatures cured. In addition to the characteristics of high thermal conductivity, this product also has a thermal expansion rate Low and high insulation characteristics, so as to eliminate electronic elements more effectively damage caused by changes in operating temperature.

PAKCOOL® TPC-213 is 1:1 two-component liquid electronic potting material, which can be solidified at room temperature or heated change. In addition to high thermal conductivity, this product also has a low thermal expansion rate and high insulation characteristics, so as to more effectively eliminate electronic components destructive effects due to changes in operating temperature.

PAKCOOL® TPC-213-08-AT is 1:1 two-component liquid electronic potting material that can be cured at room temperature or at elevated temperatures. In addition to high thermal conductivity, this product also has high temperature resistance and insulation properties advanced features.

PAKCOOL® TPC-225 is 1:1 two-component liquid electronic potting material, available at room temperature or warmed under curing. In addition to the characteristics of high thermal conductivity, this product also has thermal low expansion rate and high insulation characteristics, so as to be more effective eliminate the destructive effect of electronic components due to changes in operating temperature.