Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Performance and Features
- This series of potting glue is suitable for various potting modes.
- Low stress, more effective protection of electrical components
- 100% solid, no exudate after curing
- Excellent high and low temperature resistance, excellent weather resistance and radiation resistance and excellent dielectric properties.
- Stable chemical and mechanical properties
Widely used for bonding heat-generating electronic devices and heat sinks or metal exteriors shell. TPC-213-08 has excellent flow and leveling properties before curing.After curing, it will not be released from the protective shell due to alternating hot and cold use. The potting surface is smooth and free of volatiles. The solidity of this product The chemical system has excellent anti-toxicity, and no butt welding is required under normal circumstances. Special treatment for tin and coatings.
Applications & Uses
- Applications
- Application Area
- Cure Method
- Application Areas
- Power modules/integrated chips/power modules
- Automobile electronic products
- LED assembly
- Computer and its accessories
- Controller
- Telecommunication equipment
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| A/B Mixing Ratio | 1:1 | — | — |
| Continous Use Temperature | -50 to 200 | °C | — |
| Density | 1.77 - 1.87 | — | ASTM D792 |
| Dielectric Strength | 20 | — | ASTM D149 |
| Flame Retardant | Compliant with V-0 | — | UL 94 |
| Hardness | 35 - 45 | — | ASTM D2240 |
| Operating Period (20°C) | min. 30 | — | — |
| Thermal Conductivity | 0.7 - 0.9 | — | ASTM D5470 |
| Viscosity | 5500 - 6500 | Cps | Brookfield Viscometer |
| Volume Resistance | min. 3x10¹³ | Ω∙cm | ASTM D257 |
Technical Details & Test Data
- Crosslinking/Curing Time
Allow to cure naturally after 8 to 24 hours. PAKCOOL® TPC-213-08-DM silica gel at room temperature, cross-linking time will decrease with increasing temperature (see table below)
25°C 24 Hours 70°C 40 Minutes 100°C 30 Minutes 125°C 20 Minutes - Crosslinking/Curing Time
TPC-213-08 silica gel at room temperature for 8 to 24 hours. It can be cured naturally. Its crosslinking time will increase with temperature while shortening (see table below)
25°C 24 Hours 70°C 40 Minutes 100°C 25 Minutes 125°C 20 Minutes
Safety & Health
- Precautions
- The thermally conductive potting compound may not cure or finish in contact with some substances fully cured, these substances include: sulfur, phosphorus, nitrogen hydrate water, organic salts, etc. If the operator smokes before operation, Because there will be sulfur residues on your hands when you smoke, please wash and dry with soap. Use the silicone after cleaning your hands.
- Please seal and store, the mixed rubber should be used up at one time, avoid cause waste
- Keep away from children
Storage & Handling
- Shelf Life
- 12 Months (at less than 20°C)