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PAKCOOL® TPC-213-08-AT

1 of 8 products in this brand
PAKCOOL® TPC-213-08-AT is 1:1 two-component liquid electronic potting material that can be cured at room temperature or at elevated temperatures. In addition to high thermal conductivity, this product also has high temperature resistance and insulation properties advanced features.

Product Type: 2K (2 component) Sealant, Potting Compound, Solvent free (100% Solids) Sealant

Application Area: Electrical Components

Cure Method: Heat Cure

Chemical Family: Silicones

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Identification & Functionality

Chemical Family

Features & Benefits

Performance and Features
  • This series of potting glue is suitable for various potting modes.
  • 100% solid, no exudate after curing.
  • Stable chemical and mechanical properties
  • Low stress, more effective protection of electrical components.
  • Excellent high and low temperature resistance, excellent weather resistance and radiation resistance  and excellent dielectric properties.

 

This series of products are also widely used in heat-generating electronic between the device and the heat sink or metal case. Before curing TPC-213- 08-AT has excellent fluidity and leveling, and will not be alternate use of hot and cold to escape from the protective casing. Its potting surface light slip and no volatiles are generated.

Applications & Uses

Application Area
Cure Method
Application Areas
  • Power modules/integrated chips/power modules
  • Controller
  • Automobile electronic products
  • LED assembly
  • Telecommunication equipment
  • Computer and its accessories

Properties

Typical Properties
ValueUnitsTest Method / Conditions
A/B Mixing Ratio1:1--
Density1.61 - 1.71g/cm³ASTM D792
Dielectric Strengthmin. 20kV/mmASTM D149
Flame RetardantCompliant with V-0-UL 94
Hardness30 - 40Shore AASTM D2240
Operating Period (20°C)min. 30--
Thermal Conductivity1.1W/m.kASTM D5470
Viscositymax. 5000CpsBrookfield Viscometer

Technical Details & Test Data

Crosslinking/Curing Time

PAKCOOL® TPC-213-08-AT Silicone 8 to 24 hours at room temperature It can be cured naturally. Its crosslinking time will decrease with increasing temperature  (see table below)

25°C 24 Hours
70°C 40 Minutes
100°C 25 Minutes
125°C 20 Minutes

The data in this specification were obtained under laboratory conditions. But because Due to differences in the use environment and process, it cannot be guaranteed that the product will be correctness and suitability for certain usages and uses. User is using when using it, be sure to test it first to confirm that it is suitable for your purpose

Safety & Health

Precautions
  • The thermally conductive potting compound may not cure or finish in contact with some substances Fully cured, these substances include: compounds of sulfur, phosphorus, and nitrogen, Such as polysulfones, polysulfides, polyurethanes, substances containing amides and amines, Substances containing tin, arsenic, antimony, selenium, tellurium and some unsaturated and hydrocarbons and plasticizers.
  • Because the viscosity of A/B component is slightly different, such as machine filling The pressure of component B needs to be adjusted slightly.
  • Please seal and store, the mixed rubber should be used up at one time, avoid cause waste.
  • Keep away from children

Storage & Handling

Shelf Life
12 Months (at less than 20°C)