Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Performance and Features
- This series of potting compounds are suitable for various potting modes. · Low stress, more effective protection of electrical components. · 100% solid, no exudate after curing. · Excellent high and low temperature resistance, excellent weather resistance and radiation resistance and excellent dielectric properties.
- Stable chemical and mechanical properties
- In addition to high thermal conductivity, this product also has thermal expansion It has the characteristics of low rate and high insulation, so as to eliminate electronic elements more effectively damage caused by changes in operating temperature. This series of products is also widely Widely used for bonding heat-generating electronic devices and heat sinks or metal casings. TPC-213-08-DM has excellent flow and leveling properties before curing. After curing, it will not come out of the protective shell due to alternating hot and cold use. The potting surface is smooth and free of volatiles.
Applications & Uses
- Applications
- Application Area
- Cure Method
- Application Areas
- Led assembly
- Telecommunication equipment
- Computer and its accessories
- Power modules
- Integrated chips
- Automotive electronic products
- Controllers
Properties
- Color
- Typical Properties
| Value | Units | Test Method / Conditions | |
| A/B Mixing Ratio | 1:1 | - | - |
| Continous Use Temperature | -50 to 200 | °C | - |
| Density | 1.5 - 1.6 | g/cm³ | ASTM D792 |
| Dielectric Strength | min. 18 | kV/mm | ASTM D149 |
| Flame Retardant | Compliant with V-0 | - | UL 94 |
| Hardness | 30 - 40 | Shore A | ASTM D2240 |
| Operating Period (20°C) | min. 30 to 40 | - | - |
| Thermal Conductivity | 0.8 - 1 | W/m.k | ASTM D5470 |
| Viscosity | 1800 - 2800 | Cps | Brookfield Viscometer |
| Volume Resistance | 3x10¹³ | Ω∙cm | ASTM D257 |
Storage & Handling
- Shelf Life
- 12 Months (at less than 20°C)