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PAKCOOL® TPC-225

1 of 8 products in this brand
PAKCOOL® TPC-225 is 1:1 two-component liquid electronic potting material, available at room temperature or warmed under curing. In addition to the characteristics of high thermal conductivity, this product also has thermal low expansion rate and high insulation characteristics, so as to be more effective eliminate the destructive effect of electronic components due to changes in operating temperature.

Product Type: 2K (2 component) Sealant, Potting Compound, Solvent free (100% Solids) Sealant

Application Area: Electrical Components

Cure Method: Heat Cure

Chemical Family: Silicones

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Identification & Functionality

Chemical Family

Features & Benefits

Performance and Features
  • This series of potting glue is suitable for various potting modes.
  • Low stress, more effective protection of electrical components.
  • 100% solid, no exudate after curing.
  • Excellent high and low temperature resistance, excellent weather resistance and radiation resistance
  • excellent dielectric properties.
  • Stable chemical and mechanical properties

This series of products are also widely used for bonding heat-generating electronic devices and heat sink or metal case. TPC-225 has excellent properties before curing. Good fluidity and leveling. After curing, it will not be caused by cold or heat alternate use to escape from the protective case. Its potting surface light slip and no volatiles are generated. The curing system of this product has excellent. Good anti-toxicity, no need to solder and paint under normal circumstances and so on for special treatment.

Applications & Uses

Application Area
Cure Method
Application Areas
  • Power modules
  • Integrated chip
  • Controller
  • Telecommunication equipment
  • Computer and its accessories
  • Automobile electronic products
  • LED assembly

Properties

Typical Properties
ValueUnitsTest Method / Conditions
A/B Mixing Ratio1:1--
Continous Use Temperature-50 to 200°C-
Density2.85 - 2.95g/cm³ASTM D792
Dielectric Strengthmin. 14kV/mmASTM D149
Flame RetardantCompliant with V-0-UL 94
Hardness56 - 66Shore AASTM D2240
Operating Period (20°C)min. 30--
Thermal Conductivity2.4 - 2.6W/m.kASTM D5470
Viscosity22000 - 28000CpsBrookfield Viscometer
Volume Resistancemin. 2.4x10¹³Ω∙cmASTM D257

Technical Details & Test Data

Crosslinking/Curing Time

PAKCOOL® TPC-225 Silica at room temperature cures naturally in 8 to 24 hours. Its cross-linking time will be shortens with increasing temperature (see table below).

25°C 24 Hours
70°C 40 Minutes
100°C 25 Minutes
125°C 20 Minutes

Safety & Health

Precautions
  • The thermally conductive potting compound may not cure or be incomplete in contact with some substances curing, these substances include: sulfur, phosphorus, nitrogen hydrates, water, organic salts, etc. If the operator smokes before the operation, because there will be sulfur residues on your hands when you smoke, please wash your hands with soap before operate silicone
  • Please seal and store, the mixed rubber should be used up at one time, avoid waste.
  • Keep away from children

Storage & Handling

Shelf Life
12 Months (at less than 20°C)