Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Performance and Features
- This series of potting glue is suitable for various potting modes.
- Low stress, more effective protection of electrical components.
- 100% solid, no exudate after curing.
- Excellent high and low temperature resistance, excellent weather resistance and radiation resistance
- Superior dielectric properties.
- Stable chemical and mechanical properties
This series products are also widely used to bond heat-generating electronic devices and heat sinks or metal shell. TPC-230 has excellent fluidity and flow before curing flatness. After curing, it will not be protected from heat and cold due to alternating use out of the shell. The potting surface is smooth and free of volatiles. The curing system of this product has excellent anti-toxicity, in general under these circumstances, no special treatment is required for solder and paint.
Applications & Uses
- Applications
- Application Area
- Cure Method
- Application Field
- Automobile electronic products
- LED assembly
- Power module/integrated chip/power module
- Computer and its accessories
- Controller
- Telecommunication equipment
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| A/B Mixing Ratio | 1:1 | — | — |
| Continous Use Temperature | -50 to 200 | °C | — |
| Density | 2.87 - 2.97 | g/cm³ | ASTM D792 |
| Dielectric Constant | 4.8 | Mhz | ASTM D150 |
| Dielectric Strength | min. 18 | kV/mm | ASTM D149 |
| Flame Retardant | Compliant with V-0 | — | UL 94 |
| Hardness | 45 - 55 | Shore A | ASTM D2240 |
| Operating Period (20°C) | min. 30 | — | — |
| Thermal Conductivity | 2.9 - 3.1 | W/m.k | ASTM D5470 |
| Viscosity (Component A) | 20000 - 30000 | Cps | Brookfield Viscometer |
| Viscosity (Component B) | 55000 - 65000 | Cps | Brookfield Viscometer |
| Volume Resistance | min. 3x10¹³ | Ω∙cm | ASTM D257 |
Technical Details & Test Data
- Crosslinking/Curing Time
PAKCOOL® TPC-230 silica gel at room temperature for 8 to 24 hours. Its crosslinking time will increase with temperature while shortening (see table below)
25°C 16 Hours 70°C 40 Minutes 100°C 20 Minutes
Safety & Health
- Precautions
- Thermally conductive encapsulant may not cure or be incomplete in contact with some substances curing, these substances include: sulfur, phosphorus, nitrogen hydrates, water, organic salts, etc. If the operator smokes before the operation, because the there will be sulfur residues on your hands when you smoke, please wash your hands with soap before operate silicone.
- Because the viscosity of components A/B is slightly different, such as machine potting, component B pressure needs to be adjusted slightly.
- Sealed storage, the mixed rubber should be used up at one time to avoid causing waste
- Keep away from children
Storage & Handling
- Shelf Life
- 12 Months (at less than 20°C)