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EPOXIBOND™ 142HT-1

1 of 27 products in this brand
EB-142HT-1 is unfilled, low viscosity, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates.

Product Type: Adhesive

Application Area: Capacitor Bushings, Capacitors, Electronic Components, Fiber Optic Cables, Medical Devices, Semiconductors

Compatible Substrates & Surfaces: Ceramic, Glass, Metal

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Product Type

Features & Benefits

Applications & Uses

Compatible Substrates & Surfaces
Product Applications
  • Semiconductor: Wafer to wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill
  • Hybrid: Down-Hole petrochemical fiber optic, good hermetic seals in sensor devices, resisting high temperature packaging sensors
  • Fiber optic: Sealing fiber into ferrules, transmitting light in the optical pathway, Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays
  • Medical: Potting fiber optic bundles into ferrules for light guides and endoscopes; Capable of resisting several sterilization techniques; Meets USP Class VI Biocompatibility Standards; adhesive for catheter devices
  • Electronics Assembly: Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics; Impregnating windings in motors and inductor coils; Bonding ferrite cores and magnets; Structural adhesive for electronic components
Instruction for Use
  1. Weigh each 100 grams of PART-A to 40 grams of Hardener PART-B.
  2. Mix until uniform. Scrape the sides and bottom of container repeatedly during mixing.
  3. Apply to clean bonding surfaces and cure as recommended to achieve the desired properties.
  4. Typical cured properties were determined using recommended cure schedule.

Frozen Adhesive: Thaw premixed frozen adhesive at room temperature for 5-10 minutes. Dispense adhesive and cure at recommended schedules.

Industrial Usage

Practices of good house-keeping, safety and cleanliness should be followed before, during and after use.

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Mix Ratio (By Weight, Part A/Part B)100/40
MIxed Viscocity (at 25°C)2800 - 3800cPs
Pot Life (at 25°C, 100g)25 - 35minutes
Typical Cured Properties
ValueUnitsTest Method / Conditions
Specific Gravity1.1
Hardness88Shore D
Water Absorption (7 days at 25°C)0.03%
Lap Shear Strength to Aluminum2200psi
Flexural Strength11000psi
Flexural Modulusmin. 400,000psi
Service Temperature Range-55 to 210°C
Glass Transition Temperature (Tg)138°C
Coefficient of Thermal Expansion (Below Tg) 4310^-6/°C
Coefficient of Thermal Expansion (Above Tg) 19010^-6/°C
Dielectric Strength380Volts/mil
Dielectric Constant (at 1 kHz)3.8
Dissipation Factor (at 1 kHz)0.01
Volume Resistivity8x10^15Ω-cm

Regulatory & Compliance

Certifications & Compliance

Safety & Health

Warning

Adequate ventilation of work place and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. In case of skin contact, wash thoroughly with soap and water. For eyes, flush immediately with plenty of water for at least 10 minutes and seek medical attention.

Packaging & Availability

Available Packaging

2 parts Kit - Packaged in Pint, Quart, and 1-Gallon size
Premixed and frozen - Packaged in 3cc, 5cc, 10cc and 30cc disposable syringes and ship in dry ice at -80°C.