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EPOXIBOND™ EB-316TC-2

1 of 27 products in this brand
EB-316TC-2 is a two component, thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer, medical or optics.

Product Type: Structural Adhesive

Application Area: Printed Circuit Boards, Semiconductors

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Materials Features

Applications & Uses

Compatible Polymers & Resins
Product Applications
  • This tough adhesive has an excellent combination of shear and peel strength.
  • It has also excellent impact and vibration resistance and low temperature flexibility.
  • This high-performance epoxy adhesive passes 500 thermal cycles from -50°C to 200°C.
  • Semiconductor: capillary flow underfill for flip chip mounted die and glob top fill encapsulant.
  • Electronics: heat sinking; thermally conductive potting and general protection of PCB and SMDs; potting and protection of resistor coils or Peltier devices.
Instruction for Use
  1. Weigh each 100 grams of PART-A to 100 grams of Hardener PART-B.
  2. Mix until uniform. Scrape the sides and bottom of container repeatedly during mixing.
  3. Apply to clean bonding surfaces and cure as recommended to achieve the desired properties.
  4. Typical cured properties were determined using recommended cure schedule.
  5. Some difference in properties may occur with the alternate or other cure schedules.
Industrial Usage

Practices of good housekeeping, safety and cleanliness should be followed before, during and after use.

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Viscosity (at 25°C)min. 250000cPs
Mix Ratio by Weight (A:B)1:1
Pot Life (at 25°C, 100g)45minutes
Recommended Cure (at 80°C)2hours
Alternate Cure (at 25°C)24hours
Alternate Cure (at 100°C)1hours
Typical Cured Properties
ValueUnitsTest Method / Conditions
Specific Gravity2.1
Hardness81Shore D
Lap Shear Strength to Aluminummin. 3000psi
T-peel Strength to Aluminum14pli
Thermal Conductivity 1.8W/m °K
Service Temperature Range-55 to 200°C
Glass Transition Temperature (Tg)90°C
Coefficient of Linear Thermal Expansion (Below Tg)7710^-6/°C
Coefficient of Linear Thermal Expansion (Above Tg)min. 14010^-6/°C
Dielectric Strength420Volts/mil
Dielectric Constant (at 1 kHz)5.3
Dissipation Factor (at 1 kHz)0.4
Volume Resistivity3x10^14Ω-cm

Safety & Health

Warning

Adequate ventilation of workplace and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. In case of skin contact, wash thoroughly with soap and water. For eyes, flush immediately with plenty of water for at least 10 minutes and seek medical attention.

Packaging & Availability

Packaging Type
Packaging Options

Packaged in Pint, Quart, Gallon, and 5-Gallon size. Also available in 50ml, 200ml 400ml dual cartridges.
Premixed and frozen - Packaged in 3cc, 5cc, 10cc and 30cc disposable syringes and ship in dry ice at -80°C

Storage & Handling

Shelf Life
1 Year