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EPOXICAST™ EC-1850FT/EH-10E

1 of 8 products in this brand
EC-1850FT with EH-10E Hardener is a very low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.

Product Type: Encapsulant, Potting Compound

Application Area: Amplifiers, Oscillators, Power Transformers

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Product Applications
  1. It offers the excellent heat transfer, high voltage insulation and dimensional stability over a wide temperature range.
  2. As an encapsulant for power devices it distributes heat evenly throughout the casting, providing greater efficiency and longer working life.
  3. Excellent performance in densely packaged power supplies, integrated circuits, thick film hybrid devices, D/A converters, oscillators, amplifiers, relays, transformers and semiconductors etc.
Instruction for Use

Stir well the contents of each container every time before removing material. If the contents are hard or lumpy, warm to 80°C and mix thoroughly before removing material.

1. Weigh each 100 grams of EC-1850FT to 20 grams of Hardener EH-10E.
2. Mix until uniform. Scrape the sides and bottom of container repeatedly during mixing.
3. Apply to clean bonding surfaces and cure as recommended to achieve the desired properties.
4. Typical cured properties were determined using recommended cure schedule. Some difference in properties may occur with the alternate or other cure schedules.

Industrial Usage

Practices of good housekeeping, safety and cleanliness should be followed before, during and after use.

Product Applications

Low density, epoxy potting compound for potting electronic components with minimal weight gain.

Properties

Color
Typical Properties
ValueUnitsTest Method / Conditions
Mix Ratio by Weight100/20
Resin Viscocity (at 25°C)250,000±50,000cPs
Mixed Viscocity (at 25°C)3000 - 5000cPs
Pot Life (at 25°C, 500g)min. 8hours
Recommended Cure (at 70°C)2hours
Recommended Cure (at 150°C)2hours
Alternate Cure (at 100°C)4hours
Typical Cured Properties
ValueUnitsTest Method / Conditions
Specific Gravity1.95
Hardness92Shore D
Linear Shrinkage0.3%
Water Absorption (24 hr at Room Temperature)0.04%
Thermal Conductivity 1.2W/m °K
Service Temperature Range55 to 180°C
Glass Transition Temperature (Tg)130°C
Coefficient of Thermal Expansion (Below Tg)3410^-6/°C
Coefficient of Thermal Expansion (Above Tg)min. 14010^-6/°C
Flexural Strength12300psi
Flexural Modulus1.2x10^5psi
Dielectrie Constant (at 1 kHz, 25°C)4,73
Dielectrie Constant (at 1 kHz, 100°C)4.84
Dissipation Factor (at 1 kHz, 25°C)0.01
Dissipation Factor (at 1 kHz, 100°C)0.01
Volume Resistivity (at 25°C)1x10^16Ω-cm
Volume Resistivity (at 100°C)1.5x10^15Ω-cm

Safety & Health

Warning

Adequate ventilation of work place and ovens is essential.

Packaging & Availability

Available Packaging

2 parts Kit - Packaged in Pint, Quart, Gallon, and 5-Gallon size.

Storage & Handling

Shelf Life

The shelf life of these materials is greater than one year when stored in unopened containers at an average temperature of 25°C.