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EpoxySet Inc. EC-1012MFR-HT

EC-1012MFR-HT is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

Product Type: Encapsulant, Potting Compound

Application Area: Capacitor Bushings, Integrated Circuits, Power Transformers

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Product Applications

Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.

Instruction for Use
  1. Mix RESIN (PART-A) thoroughly each time before removing material.
  2. To each 100 grams of RESIN (PART-A), add 9 grams of HARDENER (PART-B) and mix it well preferably using a mechanical mixer.
  3. Vacuum degasses for about five minutes to remove any dissolved or entrapped air.
  4. Proceed with the casting or potting application and cure as recommended.
Industrial Usage

These materials are intended for industrial use only, and the practices of good housekeeping, safety and cleanliness should be followed before, during and after use.

Properties

Color
Flame Rating
Typical Properties
ValueUnitsTest Method / Conditions
Mixed Viscocity15000 - 20000cPs
Pot Life (at 25°C, 100g)60 - 90minutes
Recommended Cure (at 100°C)2hours
Recommended Cure (at 125°C)2hours
Alternate Cure (at 125°C)2hours
Typical Cured Properties
ValueUnitsTest Method / Conditions
Specific Gravity1.7
Hardness91Shore D
Linear Shrinkage0%
Water Absorption (24 hr at Room Temperature)max. 0.1%
Thermal Conductivity 0.9W/m °K
Service Temperature Range-55 to 200°C
Glass Transition Temperature (Tg)126°C
Coefficient of Thermal Expansion (Below Tg) 3810^-6/°C
Coefficient of Thermal Expansion (Above Tg) min. 19010^-6/°C
Flexural Strength14800psi
Flexural Modulus7x10^5psi
Dielectric Strength23KV/mm
Dielectric Constant (at 1 kHz)5.5
Breakdown Voltage550V/mil
Dissipation Factor (at 1 kHz)0.021
Volume Resistivity1.0x10^15Ω-cm

Regulatory & Compliance

Certifications & Compliance

Safety & Health

Warning

Although the system contains low volatility materials, care should be taken in handling. Adequate ventilation of work- place and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. In case of skin contact, wash thoroughly with soap and water. For eyes, flush immediately with plenty of water for at least 10 minutes and seek medical attention.

Storage & Handling

Shelf Life

The shelf life of these materials is greater than one year when stored in unopened containers at an average temperature of 25°C.