Products

STG-51TC Heat Sink Compound is silicone thermal grease material heavily filled with heat-conductive metal oxides. These combinations provide high thermal conductivity, low bleed and high temperature stability. STG-51TC specially developed to solve the problems of contamination and migration associated with silicone-based products. The compound is a unique synthetic-based thermal grease use to insure quick, efficient heat transfer and dissipation

STG-40 is a non-reactive, Silicone, Thermally Conductive Grease with a high thermal conductivity and low thermal resistance with a soft, non-flowable consistency. This product is formulated with specialty binding agents to achieve lowest amount of bleed and evaporations. It is designed for applications where a silicone thermal interface material is required and where the device may later need to be easily removed from the heat sink. This compound is ideally suited for use in thin cross-sectional thicknesses down to ≤1 mil.

HTG-72TC is our highest temperature resistance thermal grease along with very high thermal conductivity. It is a heavily filled system with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 360°C, maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

TG-45LV is a specially formulated with low viscosity/screen printable consistency to achieve low BLT and high thermal conductivity for optimum thermal performance. Exhibits excellent resistance to pump out, outgassing and phase separation while eliminating concern of silicone deposition on optics and electronics within any package. TG-45LV is high performance thermal grease designed to meet the thermal, reliability and low-price requirements of high-end chipset, graphic processors trend ever-faster clock speeds. RoHS compliant and halogen -free

TG-69 compound grease-like NON-SILICONE, NON- FLOWABLE material heavily filled with heat-conductive metal oxides. These combinations provide high thermal conductivity, low bleed and high temperature stability. TG-69 has been engineered to solve the problems of contamination and migration associated with silicone-based products. Unique polysynthetic-based thermal grease used to insure quick, efficient heat transfer and dissipation for the full operational life of your hardware.

TG-61 is Non-Silicone thermal grease is exceptionally soft, non-silicone thermal grease. In addition to solving the problems of contamination and migration associated with traditional silicone-based thermal grease, this unique material can be spread into an extremely thin film while remaining a homogenous mixture.

STG-41 is a non-reactive, Silicone, Thermally Conductive Grease with a high thermal conductivity and low thermal resistance with a soft, non-flowable consistency. This product is formulated with specialty binding agents to achieve lowest amount of bleed and evaporations. It is designed for applications where a silicone thermal interface material is required and where the device may later need to be easily removed from the heat sink. This compound is ideally suited for use in thin cross-sectional thicknesses down to ≤ 1 mil.

CTG-81 is Non-Silicone; Non-curing, silver filled electrically and thermally conductive grease. It can be used as interfacial contact for electrical and thermal transfer for power devices. This material will not dry, harden or melt in normal industrial use and provides long term material stability.

STG-44 is a non-reactive, Silicone, Thermally Conductive Grease with a high thermal conductivity and low thermal resistance with a soft, non-flowable consistency. This product is formulated with specialty binding agents to achieve lowest amount of bleed and evaporations. It is designed for applications where a silicone thermal interface material is required and where the device may later need to be easily removed from the heat sink. This compound is ideally suited for use in thin cross-sectional thicknesses down to ≤1 mil.

TG-62M is Non-Silicone thermal grease is exceptionally soft, non-silicone thermal grease. In addition to solving the problems of contamination and migration associated with traditional silicone-based thermal grease, this unique material can be spread into an extremely thin film while remaining a homogenous mixture.

HTG-71 is a high temperature resistance thermal grease,, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 300°C, maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

TG-64 is Non-Silicone thermal grease is exceptionally soft, non-silicone thermal grease. In addition to solving the problems of contamination and migration associated with traditional silicone-based thermal grease, this unique material can be spread into an extremely thin film while remaining a homogenous mixture.

CTG-87NS is non-silicone; non-curing, silver filled electrically and thermally conductive grease. It can be used as interfacial contact for electrical and thermal transfer for power devices. CTG-87NS was specially formulated using various size silver flakes to maximize particle contact resulting in an extremely high thermal conductivity. This material will not dry, harden or melt in normal industrial use and provides long term material stability.

HTG-72 – is our highest temperature resistance thermal grease, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 360°C, maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.