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SetWORX™ UV-35G

1 of 7 products in this brand
EPOXIBOND™ EB-153 is unfilled, low viscosity, heat curing, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates. It has long pot-life and has an amber color change upon cure.

Chemical Family: Epoxy & Epoxy Derivatives

Product Type: 2K (2 component) Adhesive, Adhesive

Cure Method: Air Dry, Heat Cure

Application Area: Medical Applications, Medical Devices, Optical Applications, Optoelectronics Devices

Application Method: Gun

Technical Data Sheet

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Identification & Functionality

Features & Benefits

Ready-to-Use Product Features
Features
  • UV/Epoxy hybrid system
  • Gels within seconds upon UV exposure and fully cures at ambient or elevated temperatures
  • UV-35G can be used as an adhesive or for small encapsulation applications

Applications & Uses

Application Method
Instructions for Use

To use simply insert the cartridge into the application gun and start the plunger into the cylinders using light pressure on the trigger. Next, remove the cartridge cap and expel a small amount of adhesive to be sure both sides are flowing evenly and freely. If automatic mixing of resin and hardener is desired, attach the mixing nozzle to the end of the cartridge and begin dispensing the adhesive. For hand mixing, expel the desired amount of the adhesive and mix thoroughly. Mix approximately 15 seconds after uniform color is obtained.

Properties

Typical Cured Properties
ValueUnitsTest Method / Conditions
Specific Gravity1.1
Hardness86Shore D
Lap Shear Strength to Aluminium3000psi
T-peel Strength to Aluminum (5-8mil bondline)30pli
Service Temperature Range-55 to 120°C
Glass Transition Temperature (Tg)70°C
Coefficient of Linear Thermal Expansion (Below Tg)7710⁻⁶/°C
Coefficient of Linear Thermal Expansion (Above Tg)19510⁻⁶/°C
Dielectric Strength500Volts/mil
Dielectric Constant (at 1 kHz)4.28
Dissipation Factor (at 1 kHz)0.4
Volume Resistivity2x10¹⁵ohm-cm
Handling Properties
ValueUnitsTest Method / Conditions
Viscosity (at 25°C)4,000 - 7,000cps
Mix Ratio by Weight (Resin/Hardener)2:1
Mix Ratio by Volume (Resin/Hardener)2:1
Pot Life (at 25°C, 20 grams)60 - 70minutes
Recommended Light250 - 350 (320 - 365)mW (nm)

Regulatory & Compliance

Certifications & Compliance

Technical Details & Test Data

Curing Information
  • Recommended Cure : 6-8 sec light exposure + 1 hr at 65°C
  • Alternate Cure : 1 hr at 65°C or 24 hr at 25°C

Safety & Health

Safety Information
  • For Industrial Use Only : Practices of good housekeeping, safety and cleanliness should be followed before, during and after use.
  • Warning : Although the system contains low volatility materials, care should be taken in handling. Adequate ventilation of work place and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. In case of skin contact, wash thoroughly with soap and water. For eyes, flush immediately with plenty of water for at least 10 minutes and seek medical attention. Refer to Material Safety Data Sheet for additional health and safety information.

Packaging & Availability

Packaging Type

Storage & Handling

Shelf Life
12 Months
Storage & Shelf Life

Product shall be ideally stored in a dry location in unopened containers at a temperature between 20°C to 28°C unless otherwise labeled. The shelf life of these materials is 12 months when stored in unopened containers at an average temperature of 25°C.