Products

SC-550-LV-TC-2 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-2 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.

SC-550-LV-TC-1 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-1 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.

SC-550-LV-RT is a 100% silicone solid elastomer designed for electronic potting applications. This two-component, room temperature curing system offers a hard, self-bonding, thermally conductive, low modulus material that is readily re-workable.

EPOXIBOND™ EB-155 is an undiluted, unfilled, low viscosity clear epoxy system that exhibits exceptional resistance to impact and thermal shock. This system has low exotherm and long work life. Applications includes, high bond strength adhesive for most similar and dissimilar substrates; LED displays, any fiber optic application. It can also be used for making in-place laminates or for protective coating on metals etc. Also it can be used for semi-rigid, moisture proof, gas tight seals between plastic and metallic or other substrates. This is also recommended for potting devices such as connector shells from which rigid or flexible wires may protrude directly through the epoxy.

EPOXIBOND™ EB-119M is a two component, low viscosity, heat cure epoxy designed for high temperature applications. It is especially well suited to fiber optic terminating, where optical fibers are "pot and polished" into connectors or ferrules.

EPOXIBOND™ EB-107LY is a two-part, low viscosity, clear epoxy adhesive and encapsulating material. EB-107LY is a low yellowing version of EB-107LP-2. It is recommended for bonding and encapsulating where reduced yellowing is preferred. It is recommended for joining transparent materials, such as glass, and where a thin bond line is desired. EB-107LY can be used for bonding most metals, ceramics, and some plastics.

EPOXIBOND™ EB-119SP is unfilled, low viscosity, heat curing, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates. It has long pot-life and has an amber color change upon cure.

SETWORX™ UV-35G is an epoxy adhesive and encapsulating compound designed for electronic, optical, medical, and general industrial applications Once mixed, UV-35G will polymerize and gel instantaneously upon exposure to UV light reducing fixture time to seconds. Once gelled, UV-35G will continue to cure at room temperature or at elevated temperature until fully cured. This epoxy system has 2 to 1 mixing ratio by volume and is available in easy to us dual cartridge systems.

EC-1106 is an electronic grade Optically Clear Epoxy, Encapsulating and Potting Compound. This heat curing system has very low viscosity and long work life.

EPOXIBOND™ EB-153 is unfilled, low viscosity, heat curing, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates. It has long pot-life and has an amber color change upon cure.

EP-207 is two parts, ambient temperature-cure, epoxy potting and encapsulating system. This semi-rigid system has excellent shock & vibration resistance and good thermal conductivity.

EPOXIBOND™ EB-135 is a clear epoxy adhesive designed for electronic, optical, medical, and general applications and for casting of small electrical components. This epoxy system has 2 to 1 mixing ratio by volume & cure fast at moderate temperature. The cured adhesive gives high impact and bond strength. It can be used for bonding glass, metals, woods and some plastics

FLASHBOND™ UV-3607HTis a 1-component, UV/Thermal cure adhesive & sealant. This material can cure under moderate intensity UV light as well as elevated temperatures for shadowed areas. Its low viscosity is ideal for coating, capillary action, and doming applications. Unlike traditional dual cure epoxy systems which need light + heat, UV-3607HT can cure either with UV/LED light or with heat.

EPOXIBOND™ EB-135LP is a clear epoxy adhesive designed for electronic, optical, medical, and general applications and for casting of small electrical components. This epoxy system has 2 to 1 mixing ratio by volume & cure fast at moderate temperature. The cured adhesive gives high impact and bond strength. It can be used for bonding glass, metals, woods and some plastics.