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Polytec EC 244 is a standard two-component, solvent-free, electrically conductive epoxy adhesive with a short pot life and curing at room temperatures. Polytec EC 244 is suggested for short time processing and low temperature curing applications. Polytec EC 244 can be also cured at 50°C in 1h. The material can be applied by dispensing or manually.

Product Type: 2K (2 component) Adhesive, Conductive Adhesive, Epoxy Adhesive, Solvent free (100% Solids) Adhesive

Cure Method: Air Dry

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet
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Identification & Functionality

Features & Benefits

Ready-to-Use Product Features

Applications & Uses

Cure Method
Processing
  • For two component products the components A and B should be mixed carefully within the specified mixing ratio
  • For filled products both components should be homogenized carefully prior mixing, in order to prevent a possible settling of the filler
  • Processing should be carried out rapidly after mixing the components as an indication the pot life can be used
  • Surfaces should be clean, thus free of dirt, grease, oil, dust or process chemicals
  • One component products can be applied directly and are not subject to a pot life (except pre mixed/frozen products)
  • Please take notice of respective minimum curing temperature and time

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Curing Time (23°C)24.0Hours-
Curing Time (50°C)60.0Minutes-
Curing Time (80°C)15.0Minutes-
Curing Temperaturemin. 23°C-
Cured Properties
ValueUnitsTest Method / Conditions
Elasticity Modulus4800.0N/mm²TM 605
Elongation at Break0.7%TM 605
Hardness70.0Shore DDIN EN ISO 868
Lap Shear Strength (Al/Al)7.8N/mm²TM 604
Specific Volume Resistivitymax. 5x10^-3Ohm-cmDIN EN ISO 3915
Temperature Resistance Continuous-40 to 150°CTM 302
Temperature Resistance Short Term180.0°CTM 302
Tensile Strength27.0N/mm²TM 605
Uncured Properties
ValueUnitsTest Method / Conditions
Chemical BasisEpoxy--
ConsistencyCreamy Paste-TM 101
Density (Mix)2.96g/cm³TM 201.2
Particle Sizemax. 40μm-
Mixing Ratio (Weight)1900-01-03T04:10:00+00:00--
Number of Components2.0--
Type of FillerSilver--
Viscosity Mix (84s⁻¹, 23°C)9000.0mPa.sTM 202.1
Viscosity A-Part (10s⁻¹, 23°C)180000.0mPa.sTM 202.4
Viscosity B Part (84s⁻¹, 23°C)600.0mPa.sTM 202.1
Note

*Curing temperatures refer to the temperature in the respective bond line. When choosing the respective curing conditions, the time needed to heat the substrate has to be considered. Depending on the type of heat source (convection oven, hot stamp, heating plate) the heat input may vary.

Packaging & Availability

Standard Pack Sizes
  • 30 g, 250 g, 500 g
  • Customized Packaging

Storage & Handling

Pot Life (23°C)
15 Minutes
Storage Stability (23°C)
12 Months