- Applications:Medical Tapes & Adhesives, Stationery, Art & Office Supplies, Semiconductor Manufacturing
- Product Families:Conductive Adhesives, Adhesives & Sealants
- Chemical Family:Epoxy & Epoxy Derivatives
Polytec EC 151-L is a standard two- component, solvent free epoxy resin optimized for stamping application, with a long pot life, high temperature stability and excellent electrical conductivity. It can be used for high volume chip and substrate bonding, in micro-electronic, hybrid and optoelectronic application. Polytec EC 151-L can be cured at 95°C or allows rapid cure cycles at higher temperatures and will withstand reflow and wire bond processes. The material can be applied by stamping, (jet-) dispensing or manually.