Products

Polytec EC 151-L is a standard two- component, solvent free epoxy resin optimized for stamping application, with a long pot life, high temperature stability and excellent electrical conductivity. It can be used for high volume chip and substrate bonding, in micro-electronic, hybrid and optoelectronic application. Polytec EC 151-L can be cured at 95°C or allows rapid cure cycles at higher temperatures and will withstand reflow and wire bond processes. The material can be applied by stamping, (jet-) dispensing or manually.

Polytec EC 101 is a standard two-component, solvent free, heat curing epoxy resin with a long pot life and excellent electrical conductivity. It is used for high volume chip and substrate bonding, in micro-electronic, medical, hybrids and optoelectronic application. Polytec EC 101 is certified to USP Class VI Biocompatibility Standards. Polytec EC 101 can be cured at 95°C or in rapid cure cycles at higher temperatures. The material can be applied by dispensing, jet-dispensing or manually.